IDTSTAC9758XXTAEB1XR IDT, Integrated Device Technology Inc, IDTSTAC9758XXTAEB1XR Datasheet - Page 114

• Manufacturer Part Number: IDTSTAC9758XXTAEB1XR
• Description: IC CODEC AC'97 6CH 2.3 48-TQFP
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Audio Codec '97r

Specifications of IDTSTAC9758XXTAEB1XR

• Data Interface: Serial
• Resolution (bits): 20 b
• Number Of Adcs / Dacs: 2 / 3
• Sigma Delta: Yes
• Voltage - Supply, Analog: 3.14 V ~ 3.47 V; 4.75 V ~ 5.25 V
• Voltage - Supply, Digital: 3.14 V ~ 3.47 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP, 48-VQFP
• Single Supply Voltage (typ): 3.3/5V
• Single Supply Voltage (min): 3.135V
• Single Supply Voltage (max): 3.465/5.25V
• Package Type: TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: STAC9758XXTAEB1XR

15. SOLDER REFLOW PROFILE
IDT™
HIGH-PERFORMANCE 6-CHANNEL AC’97 2.3 CODEC WITH UNIVERSAL JACKS™
STAC9758/9759
HIGH-PERFORMANCE 6-CHANNEL AC’97 2.3 CODEC WITH UNIVERSAL JACKS™
15.1. Standard Reflow Profile Data
Time maintained above
Time within 5
Note: All temperatures refer to topside of the package, measured on the package body surface.
Preheat
Peak / Classification Temperature (Tp)
Profile Feature
Average Ramp-Up Rate (Ts
Note: These devices can be hand soldered at 360
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices” (www.jedec.org/download).
o
C of actual Peak Temperature (tp)
Time 25
Temperature Max (Ts
Temperature Min (Ts
o
C to Peak Temperature
Time (ts
Temperature (T
Ramp-Down rate
min
Figure 23. Solder Reflow Profile
max
Time (t
- ts
- Tp)
max
max
min
L
L
)
)
)
)
)
3
150
200
60 - 180 seconds
217
60 - 150 seconds
See “Package Classification Reflow Temperatures” on page 115.
20 - 40 seconds
6
8 minutes max
o
o
C / second max
C / second max
114
o
o
o
C
C
C
o
C for 3 to 5 seconds.
Pb Free Assembly
STAC9758/9759
PC AUDIO
V 1.2 1206