MPC855TCVR50D4 Freescale Semiconductor, MPC855TCVR50D4 Datasheet - Page 73

IC MPU POWERQUICC 50MHZ 357PBGA

MPC855TCVR50D4

Manufacturer Part Number
MPC855TCVR50D4
Description
IC MPU POWERQUICC 50MHZ 357PBGA
Manufacturer
Freescale Semiconductor

Specifications of MPC855TCVR50D4

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Processor Series
MPC8xx
Core
MPC8xx
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 95 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.465/3.6V
Operating Supply Voltage (min)
2/3.135V
Operating Temp Range
-40C to 95C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC855TCVR50D4
Manufacturer:
FREESCAL
Quantity:
246
Part Number:
MPC855TCVR50D4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC855TCVR50D4R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
the heat sink should be slowly removed. Heating the heat sink to 40–50
interface material and make the removal easier. The use of an adhesive for heat sink attach is not
recommended.
The system board designer can choose between several types of thermal interface. There are several
commercially-available thermal interfaces provided by the following vendors:
Freescale Semiconductor
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
18930 West 78
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
1.5
0.5
2
1
0
Figure 46. Thermal Performance of Select Thermal Interface Materials
0
th
St.
10
20
Contact Pressure (psi)
30
40
800-248-2481
781-935-4850
888-642-7674
800-347-4572
50
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
°
C with an air gun can soften the
70
80
Thermal
73

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