MPC855TCVR50D4 Freescale Semiconductor, MPC855TCVR50D4 Datasheet - Page 36

IC MPU POWERQUICC 50MHZ 357PBGA

MPC855TCVR50D4

Manufacturer Part Number
MPC855TCVR50D4
Description
IC MPU POWERQUICC 50MHZ 357PBGA
Manufacturer
Freescale Semiconductor

Specifications of MPC855TCVR50D4

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Processor Series
MPC8xx
Core
MPC8xx
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 95 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.465/3.6V
Operating Supply Voltage (min)
2/3.135V
Operating Temp Range
-40C to 95C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Local Bus
Notes:
1. The symbols used for timing specifications herein follow the pattern of t
2. All timings are in reference to LSYNC_IN for DLL enabled mode.
3. All signals are measured from OV
4. Input timings are measured at the pin.
5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
6. The value of t
7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between
8. Guaranteed by characterization.
9. Guaranteed by design.
Figure 16
36
Local bus clock to address valid for LAD
Output hold from local bus clock (except
LAD/LDP and LALE)
Output hold from local bus clock for
LAD/LDP
Local bus clock to output high Impedance
(except LAD/LDP and LALE)
Local bus clock to output high impedance
for LAD/LDP
for inputs and t
timing (LB) for the input (I) to go invalid (X) with respect to the time the t
clock one(1). Also, t
output (O) going invalid (X) or output hold time.
in question for 3.3-V signaling levels.
through the component pin is less than or equal to the leakage current specification.
bus buffer delays used as programmed at power-on reset with configuration pins LWE[0:1].
complementary signals at OV
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
provides the AC test load for the local bus.
LBOTOT
Parameter
(First two letters of functional block)(reference)(state)(signal)(state)
Table 31. Local Bus General Timing Parameters—DLL Bypassed (continued)
LBKHOX
is defined as the sum of 1/2 or 1 ccb_clk cycle as programmed by LBCR[AHD], and the number of local
Output
symbolizes local bus timing (LB) for the t
DD
/2.
DD
/2 of the rising edge of local bus clock for DLL bypass mode to 0.4 × OV
Figure 16. Local Bus C Test Load
LWE[0:1] = 11 (default)
LWE[0:1] = 11 (default)
LWE[0:1] = 11 (default)
LWE[0:1] = 11 (default)
LWE[0:1] = 11 (default)
Z
Configuration
LWE[0:1] = 00
LWE[0:1] = 00
LWE[0:1] = 00
LWE[0:1] = 00
LWE[0:1] = 00
0
= 50 Ω
7
LBK
Symbol
for outputs. For example, t
t
t
t
t
t
LBKLOV3
LBKLOX1
LBKLOX2
LBKLOZ1
LBKLOZ2
(First two letters of functional block)(signal)(state) (reference)(state)
LBK
clock reference (K) to go high (H), with respect to the
R
clock reference (K) goes high (H), in this case for
L
1
= 50 Ω
–2.7
–1.8
–2.7
–1.8
Min
OV
DD
Max
0.8
2.3
1.0
2.4
1.0
2.4
/2
LBIXKH1
Freescale Semiconductor
symbolizes local bus
Unit
ns
ns
ns
ns
ns
DD
of the signal
Notes
3
3
3
5
5

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