MPC855TCVR50D4 Freescale Semiconductor, MPC855TCVR50D4 Datasheet - Page 22

IC MPU POWERQUICC 50MHZ 357PBGA

MPC855TCVR50D4

Manufacturer Part Number
MPC855TCVR50D4
Description
IC MPU POWERQUICC 50MHZ 357PBGA
Manufacturer
Freescale Semiconductor

Specifications of MPC855TCVR50D4

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Processor Series
MPC8xx
Core
MPC8xx
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 95 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.465/3.6V
Operating Supply Voltage (min)
2/3.135V
Operating Temp Range
-40C to 95C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Ethernet: Three-Speed, MII Management
7.2
Table 17
8
This section provides the AC and DC electrical characteristics for three-speed, 10/100/1000, and MII
management.
8.1
The electrical characteristics specified here apply to all GMII (gigabit media independent interface), the
MII (media independent interface), TBI (ten-bit interface), RGMII (reduced gigabit media independent
interface), and RTBI (reduced ten-bit interface) signals except MDIO (management data input/output) and
MDC (management data clock). The RGMII and RTBI interfaces are defined for 2.5 V, while the GMII
and TBI interfaces can be operated at 3.3 V or 2.5 V. Whether the GMII, MII, or TBI interface is operated
at 3.3 or 2.5 V, the timing is compliant with the IEEE 802.3 standard. The RGMII and RTBI interfaces
follow the Hewlett-Packard reduced pin-count interface for Gigabit Ethernet Physical Layer Device
Specification Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are specified in
Section 8.3, “Ethernet Management Interface Electrical
8.1.1
All GMII, MII, TBI, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes
specified in
RTBI receiver may exceed the potential of the receiver’s power supply (for example, a GMII driver
powered from a 3.6-V supply driving V
for dissimilar GMII driver and receiver supply potentials is implicit in these specifications. The RGMII
and RTBI signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5.
22
Ethernet: Three-Speed, MII Management
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
provides the AC timing parameters for the DUART interface of the MPC8555E.
DUART AC Electrical Specifications
Three-Speed Ethernet Controller (TSEC)
(10/100/1000 Mbps)—GMII/MII/TBI/RGMII/RTBI Electrical
Characteristics
TSEC DC Electrical Characteristics
Table 18
Minimum baud rate
Maximum baud rate
Oversample rate
Notes:
1. Actual attainable baud rate is limited by the latency of interrupt processing.
2. The middle of a start bit is detected as the 8
3. Guaranteed by design.
bit. Subsequent bit values are sampled each 16
Parameter
and
Table
Table 17. DUART AC Timing Specifications
19. The potential applied to the input of a GMII, MII, TBI, RGMII, or
f
CCB_CLK
OH
f
CCB_CLK
into a GMII receiver powered from a 2.5-V supply). Tolerance
Value
16
/ 1048576
/ 16
th
sampled 0 after the 1-to-0 transition of the start
th
Characteristics.”
sample.
baud
baud
Unit
Notes
1, 3
2, 3
3
Freescale Semiconductor

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