MPC855TCVR50D4 Freescale Semiconductor, MPC855TCVR50D4 Datasheet - Page 31

IC MPU POWERQUICC 50MHZ 357PBGA

MPC855TCVR50D4

Manufacturer Part Number
MPC855TCVR50D4
Description
IC MPU POWERQUICC 50MHZ 357PBGA
Manufacturer
Freescale Semiconductor

Specifications of MPC855TCVR50D4

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Processor Series
MPC8xx
Core
MPC8xx
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 95 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.465/3.6V
Operating Supply Voltage (min)
2/3.135V
Operating Temp Range
-40C to 95C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Figure 14
8.3
The electrical characteristics specified here apply to MII management interface signals MDIO
(management data input/output) and MDC (management data clock). The electrical characteristics for
GMII, RGMII, TBI and RTBI are specified in
(10/100/1000 Mbps)—GMII/MII/TBI/RGMII/RTBI Electrical Characteristics.”
8.3.1
The MDC and MDIO are defined to operate at a supply voltage of 3.3 V. The DC electrical characteristics
for MDIO and MDC are provided in
Freescale Semiconductor
Supply voltage (3.3 V)
Output high voltage
Output low voltage
Input high voltage
Input low voltage
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Parameter
(At Transmitter)
Ethernet Management Interface Electrical Characteristics
shows the RBMII and RTBI AC timing and multiplexing diagrams.
RXD[8:5][3:0]
RXD[7:4][3:0]
TXD[8:5][3:0]
TXD[7:4][3:0]
MII Management DC Electrical Characteristics
GTX_CLK
(At PHY)
(At PHY)
RX_CTL
RX_CLK
TX_CLK
TX_CTL
Figure 14. RGMII and RTBI AC Timing and Multiplexing Diagrams
Table 27. MII Management DC Electrical Characteristics
Symbol
OV
V
V
V
V
OH
OL
IH
IL
DD
RXD[3:0]
TXD[3:0]
RXD[4]
TXD[4]
TXEN
RXDV
Table
I
OH
I
OL
= –1.0 mA
= 1.0 mA
27.
RXD[8:5]
RXD[7:4]
TXD[8:5]
TXD[7:4]
RXERR
TXERR
RXD[9]
TXD[9]
Conditions
Section 8.1, “Three-Speed Ethernet Controller (TSEC)
LV
LV
DD
DD
= Min
= Min
t
t
SKRGT
SKRGT
t
RGTH
GND
3.13
2.10
1.70
Min
Ethernet: Three-Speed, MII Management
t
RGT
LV
DD
Max
3.47
0.50
0.90
t
t
SKRGT
SKRGT
+ 0.3
Unit
V
V
V
V
V
31

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