MPC855TCVR50D4 Freescale Semiconductor, MPC855TCVR50D4 Datasheet - Page 2
MPC855TCVR50D4
Manufacturer Part Number
MPC855TCVR50D4
Description
IC MPU POWERQUICC 50MHZ 357PBGA
Manufacturer
Freescale Semiconductor
Datasheets
1.MPC855TVR50D4.pdf
(15 pages)
2.MPC8555ECVTALF.pdf
(88 pages)
3.MPC855TCVR50D4.pdf
(80 pages)
Specifications of MPC855TCVR50D4
Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Processor Series
MPC8xx
Core
MPC8xx
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 95 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.465/3.6V
Operating Supply Voltage (min)
2/3.135V
Operating Temp Range
-40C to 95C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC855TCVR50D4
Manufacturer:
FREESCAL
Quantity:
246
Company:
Part Number:
MPC855TCVR50D4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC855TCVR50D4R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Overview
1
The following section provides a high-level overview of the MPC8555E features.
major functional units within the MPC8555E.
1.1
The following lists an overview of the MPC8555E feature set.
2
•
MIIs/RMIIs
UTOPIA
Overview
Embedded e500 Book E-compatible core
— High-performance, 32-bit Book E-enhanced core that implements the PowerPC architecture
— Dual-issue superscalar, 7-stage pipeline design
— 32-Kbyte L1 instruction cache and 32-Kbyte L1 data cache with parity protection
— Lockable L1 caches—entire cache or on a per-line basis
— Separate locking for instructions and data
— Single-precision floating-point operations
— Memory management unit especially designed for embedded applications
— Enhanced hardware and software debug support
— Dynamic power management
— Performance monitor facility
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
SDRAM
MPHY
TDMs
GPIO
IRQs
Key Features
32b
I/Os
DDR
DDR SDRAM Controller
Local Bus Controller
Interrupt Controller
Programmable
SCC/USB
I
2
C Controller
CPM
SMC
SMC
FCC
FCC
SCC
SCC
DUART
SPI
I
2
C
Generators
Parallel I/O
Baud Rate
I-Memory
Controller
Interrupt
DPRAM
Engine
Timers
Serial
RISC
CPM
ROM
DMA
Figure 1. MPC8555E Block Diagram
Coherency
Module
OCeaN
e500
Security
Engine
Core Complex
256-Kbyte
L2 Cache/
SRAM
Bus
64/32b PCI Controller
0/32b PCI Controller
10/100/1000 MAC
10/100/1000 MAC
DMA Controller
32-Kbyte L1
I Cache
Figure 1
e500 Core
Freescale Semiconductor
MII, GMII, TBI,
RTBI, RGMIIs
32-Kbyte L1
D Cache
shows the