EP3C25F324I7 Altera, EP3C25F324I7 Datasheet - Page 15

IC CYCLONE III FPGA 25K 324 FBGA

EP3C25F324I7

Manufacturer Part Number
EP3C25F324I7
Description
IC CYCLONE III FPGA 25K 324 FBGA
Manufacturer
Altera
Series
Cyclone® IIIr

Specifications of EP3C25F324I7

Number Of Logic Elements/cells
24624
Number Of Labs/clbs
1539
Total Ram Bits
608256
Number Of I /o
215
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
324-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
24624
# I/os (max)
215
Frequency (max)
437.5MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
24624
Ram Bits
608256
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Package Type
FBGA
For Use With
544-2370 - KIT STARTER CYCLONE III EP3C25
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EP3C25F324I7
Manufacturer:
Altera
Quantity:
10 000
Part Number:
EP3C25F324I7
Manufacturer:
ALTERA
0
Part Number:
EP3C25F324I7
0
Part Number:
EP3C25F324I7N
Manufacturer:
ALTERA32
Quantity:
181
Part Number:
EP3C25F324I7N
Manufacturer:
Altera
Quantity:
10 000
Part Number:
EP3C25F324I7N
Manufacturer:
XILINX
0
Part Number:
EP3C25F324I7N
Manufacturer:
ALTERA
0
Part Number:
EP3C25F324I7N
0
Cyclone III Device Family Features
Lowest Power FPGAs
© December 2009
CIII51001-2.2
Altera Corporation
Cyclone
power and low cost. Based on Taiwan Semiconductor Manufacturing Company
(TSMC) low-power (LP) process technology, silicon optimizations and software
features to minimize power consumption, Cyclone III device family provides the ideal
solution for your high-volume, low-power, and cost-sensitive applications. To address
the unique design needs, Cyclone III device family offers the following two variants:
With densities ranging from 5K to 200K logic elements (LEs) and 0.5 Mbits to 8 Mbits
of memory for less than ¼ watt of static power consumption, Cyclone III device
family makes it easier for you to meet your power budget. Cyclone III LS devices are
the first to implement a suite of security features at the silicon, software, and
intellectual property (IP) level on a low-power and high-functionality FPGA platform.
This suite of security features protects the IP from tampering, reverse engineering and
cloning. In addition, Cyclone III LS devices support design separation which enables
you to introduce redundancy in a single chip to reduce size, weight, and power of
your application.
This chapter contains the following sections:
Cyclone III device family offers the following features:
Cyclone III: lowest power, high functionality with the lowest cost
Cyclone III LS: lowest power FPGAs with security
“Cyclone III Device Family Features” on page 1–1
“Cyclone III Device Family Architecture” on page 1–6
“Reference and Ordering Information” on page 1–12
Lowest power consumption due to:
Low-power operation offers the following benefits:
Hot-socketing operation support
TSMC low-power process technology
Altera
Extended battery life for portable and handheld applications
Reduced or eliminated cooling system costs
Operation in thermally-challenged environments
®
III device family offers a unique combination of high functionality, low
®
power-aware design flow
1. Cyclone III Device Family Overview
Cyclone III Device Handbook, Volume 1

Related parts for EP3C25F324I7