EP3C25F324I7 Altera, EP3C25F324I7 Datasheet - Page 125

• Manufacturer Part Number: EP3C25F324I7
• Description: IC CYCLONE III FPGA 25K 324 FBGA
• Manufacturer: Altera
• Series: Cyclone® IIIr

Specifications of EP3C25F324I7

• Number Of Logic Elements/cells: 24624
• Number Of Labs/clbs: 1539
• Total Ram Bits: 608256
• Number Of I /o: 215
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 324-FBGA
• Family Name: Cyclone III
• Number Of Logic Blocks/elements: 24624
• # I/os (max): 215
• Frequency (max): 437.5MHz
• Process Technology: 65nm
• Operating Supply Voltage (typ): 1.2V
• Logic Cells: 24624
• Ram Bits: 608256
• Operating Supply Voltage (min): 1.15V
• Operating Supply Voltage (max): 1.25V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 324
• Package Type: FBGA
• For Use With: 544-2370 - KIT STARTER CYCLONE III EP3C25
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Not Compliant

High-Speed I/O Interface
© December 2009
CIII51008-3.2
f
Altera Corporation
This chapter describes the high-speed differential I/O features and resources in the
Cyclone III device family.
High-speed differential I/O standards have become popular in high-speed interfaces
because of their significant advantages over single-ended I/O standards. The Altera
Cyclone
BLVDS, reduced swing differential signaling (RSDS), mini-LVDS, and point-to-point
differential signaling (PPDS).
This chapter contains the following sections:
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Cyclone III device family I/Os are separated into eight I/O banks, as shown in
Figure
LVDS, RSDS, mini-LVDS, and PPDS are on the left and right I/O banks. These I/O
standards are also supported on the top and bottom I/O banks using external
resistors. On the left and right I/O banks, some of the differential pin pairs (p and n
pins) of the true output drivers are not located on adjacent pins. In these cases, a
power pin is located between the p and n pins. These I/O standards are also
supported on all I/O banks using two single-ended output with the second output
programmed as inverted, and an external resistor network. True input buffers for
these I/O standards are supported on all I/O banks.
For more information about the location of Cyclone III device family true differential
pins, refer to the
“High-Speed I/O Interface” on page 7–1
“High-Speed I/O Standards Support” on page 7–7
“True Output Buffer Feature” on page 7–15
“High-Speed I/O Timing” on page 7–16
“Design Guidelines” on page 7–17
“Software Overview” on page 7–18
7–1. Each bank has an independent power supply. True output drivers for
®
III device family (Cyclone III and Cyclone III LS devices) supports LVDS,
Cyclone III Devices Pin-Outs
7. High-Speed Differential Interfaces in
the Cyclone III Device Family
on the Altera website.
Cyclone III Device Handbook, Volume 1
®