MT48LC8M32B2P-6 Micron Technology Inc, MT48LC8M32B2P-6 Datasheet - Page 56

• Manufacturer Part Number: MT48LC8M32B2P-6
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC8M32B2P-6

• Organization: 8Mx32
• Density: 256Mb
• Address Bus: 14b
• Access Time (max): 17/7.5/5.5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 165mA
• Pin Count: 86
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

NOTE:
09005aef8140ad6d
MT48LC8M32B2_2.fm - Rev. B 10/04 EN
1. All dimensions in millimeters.
2. Recommended pad size for PCB is 0.4mm ±0.03mm.
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
90X Ø0.45 ±0.05
SEATING PLANE
11.20 ±0.10
0.10 C
BALL A9
5.60 ±0.05
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
C
0.65 ±0.05
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
3.20 ±0.05
8.00 ±0.10
Figure 49: 90-Ball FBGA (8mm x 13mm)
All other trademarks are the property of their respective owners.
6.40
C L
4.00 ±0.05
0.80 TYP
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
13.00 ±0.10
56
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag (F5) OR
96.5% Sn, 3%Ag, 0.5% Cu (B5)
SOLDER MASK DEFINED BALL PADS: Ø0.40
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
©2003 Micron Technology, Inc. All rights reserved.
256Mb: x32
BALL A1 ID
SDRAM