SAF-XC164CS-32F40F BB-A Infineon Technologies, SAF-XC164CS-32F40F BB-A Datasheet - Page 58

IC MCU 16BIT 256KB FLSH 100TQFP

SAF-XC164CS-32F40F BB-A

Manufacturer Part Number
SAF-XC164CS-32F40F BB-A
Description
IC MCU 16BIT 256KB FLSH 100TQFP
Manufacturer
Infineon Technologies
Series
XC16xr
Datasheet

Specifications of SAF-XC164CS-32F40F BB-A

Core Processor
C166SV2
Core Size
16-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SPI, UART/USART
Peripherals
PWM, WDT
Number Of I /o
79
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 2.7 V
Data Converters
A/D 14x8/10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LFQFP
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
2xASC, 2xSSC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
79
Number Of Timers
11
Operating Supply Voltage
5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 14 Channel
Packages
PG-TQFP-100
Max Clock Frequency
40.0 MHz
Sram (incl. Cache)
12.0 KByte
Can Nodes
2
A / D Input Lines (incl. Fadc)
14
Program Memory
256.0 KByte
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Table 12
Port Output Driver
Mode
Strong driver
Medium driver
Weak driver
1) An output current above |
Table 13
Parameter
Power supply current (active)
with all peripherals active
Pad supply current
Idle mode supply current
with all peripherals active
Sleep and Power down mode
supply current caused by
leakage
Sleep and Power down mode
supply current caused by
leakage and the RTC running,
clocked by the main oscillator
1) During Flash programming or erase operations the supply current is increased by max. 5 mA.
2) The supply current is a function of the operating frequency. This dependency is illustrated in
3) The pad supply voltage pins (
4) The total supply current in Sleep and Power down mode is the sum of the temperature dependent leakage
5) This parameter is determined mainly by the transistor leakage currents. This current heavily depends on the
Data Sheet
For any group of 16 neighboring port output pins the total output current in each direction (Σ
remain below 50 mA.
These parameters are tested at
all inputs at
amount of current is consumed even though no outputs are driven, because the drivers’ input stages are
switched and also the Flash module draws some power from the
current and the frequency dependent current for RTC and main oscillator (if active).
junction temperature (see
if no current flows through the port output drivers. Otherwise, the resulting temperature difference must be
taken into account.
4)
V
IL
Current Limits for Port Output Drivers
Power Consumption XC164CS (Operating Conditions apply)
or
V
IH
.
I
Figure
OXnom
Maximum Output Current
(
10 mA
4.0 mA
0.5 mA
I
OLmax
V
DDP
| may be drawn from up to three pins at the same time.
V
DDImax
13). The junction temperature
4)
) mainly provides the current consumed by the pin output drivers. A small
, -
I
Sym-
bol
I
I
I
I
I
and maximum CPU clock frequency with all outputs disconnected and
OHmax
DDI
DDP
IDX
PDL
PDM
5)
7)
)
1)
Min.
56
Limit Values
Max.
10 +
3.0 ×
5
10 +
1.3 ×
128,000
× e
0.6 +
0.02 ×
+
I
PDL
T
J
V
f
f
is the same as the ambient temperature
CPU
CPU
DDP
f
Nominal Output Current
(
2.5 mA
1.0 mA
0.1 mA
OSC
I
OLnom
supply.
Unit Test Condition
mA
mA
mA
mA
mA
, -
Electrical Parameters
I
OHnom
f
3)
f
V
T
α =
4670 / (273 +
V
f
CPU
CPU
OSC
J
DDI
DDI
in [°C]
)
in [MHz]
in [MHz]
I
in [MHz]
=
=
OL
Derivatives
V
V
V1.1, 2006-08
Figure
and Σ-
XC164-32
DDImax
DDImax
I
OH
1)2)
2)
11.
6)
T
) must
J
)
T
A

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