HD64F3048F16 Renesas Electronics America, HD64F3048F16 Datasheet - Page 893

IC H8 MCU FLASH 128K 100QFP

HD64F3048F16

Manufacturer Part Number
HD64F3048F16
Description
IC H8 MCU FLASH 128K 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of HD64F3048F16

Core Processor
H8/300H
Core Size
16-Bit
Speed
8MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Package
100PQFP
Family Name
H8
Maximum Speed
16 MHz
Operating Supply Voltage
5 V
Data Bus Width
16|32 Bit
Number Of Programmable I/os
70
Interface Type
SCI
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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D.2
Reset in T1 State
Figure D.1 is a timing diagram for the case in which RES goes low during the T1 state of an
external memory access cycle. As soon as RES goes low, all ports are initialized to the input state.
AS, RD, HWR, and LWR go high, and the data bus goes to the high-impedance state. The address
bus is initialized to the low output level 0.5 state after the low level of RES is sampled. Sampling
of RES takes place at the fall of the system clock ( ).
RES
Internal
reset signal
Address bus
CS
CS
AS
RD (read access)
HWR, LWR
(write access)
Data bus
(write access)
I/O port
0
7
Pin States at Reset
to CS
Figure D.1 Reset during Memory Access (Reset during T1 State)
1
High
High
High
Access to external address
T1
T2
Rev. 3.00 Sep 27, 2006 page 865 of 872
T3
H'000000
Appendix D Pin States
High-impedance
High-impedance
High-impedance
REJ09B0325-0300

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