AT91M55800A-33CJ Atmel, AT91M55800A-33CJ Datasheet - Page 244

• Manufacturer Part Number: AT91M55800A-33CJ
• Description: IC ARM MCU 16BIT 176BGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91M55800A-33CJ

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: POR, WDT
• Number Of I /o: 58
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Processor Series: AT91Mx
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: EBI, SPI, USART
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 58
• Number Of Timers: 10 bit
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91EB55
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• On-chip Dac: 8 bit, 2 Channel
• Cpu Family: AT91
• Device Core: ARM7TDMI
• Device Core Size: 32b
• Frequency (max): 33MHz
• Program Memory Size: Not Required
• Total Internal Ram Size: 8KB
• # I/os (max): 58
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 176
• Package Type: BGA
• For Use With: AT91EB55 - KIT EVAL FOR ARM AT91M55800A
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

25. Soldering Profile
25.1
25.2
244
LQFP Soldering Profile (Green)
BGA Soldering Profile (RoHS-compliant)
AT91M5880A
Table 25-1
Table 25-1.
Note:
A maximum of three reflow passes is allowed per component.
Table 25-2
Table 25-2.
Note:
A maximum of three reflow passes is allowed per component.
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5°C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25°C to Peak Temperature
Profile Feature
Average Ramp-up Rate (183°C to Peak)
Preheat Temperature 125°C ±25°C
Temperature Maintained Above 183°C
Time within 5°C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25°C to Peak Temperature
The package is certified to be backward compatible with Pb/Sn soldering profile.
It is recommended to apply a soldering temperature higher than 250°C.
gives the recommended soldering profile from J-STD-020C.
gives the recommended soldering profile from J-STD-20C.
Soldering Profile Green Compliant Package
Soldering Profile RoHS Compliant Package
Green Package
3°C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260 +0 °C
6°C/sec. max.
8 min. max.
Convection or IR/Convection
3°C/sec. max.
180 sec. max
60 sec. to 150 sec.
20 sec. to 40 sec.
260 + 0°C
6°C/sec.
8 min. max
1745F–ATARM–06-Sep-07