D6417709SF167BV Renesas Electronics America, D6417709SF167BV Datasheet - Page 688

IC SUPER H MPU ROMLESS 208LQFP

D6417709SF167BV

Manufacturer Part Number
D6417709SF167BV
Description
IC SUPER H MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of D6417709SF167BV

Core Processor
SH-3
Core Size
32-Bit
Speed
167MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.75 V ~ 2.05 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D6417709SF167BV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
mode, boundary scan and emulator functions can be used. The input level at the ASEMD0 pin
should be held for at least one cycle after RESETP negation.
A A A A S S S S E E E E B B B B R R R R KAK
22.2.2
Figure 22.1 shows a block diagram of the UDI.
22.3
The UDI has the following registers.
Rev. 5.00, 09/03, page 642 of 760
SDBPR: Bypass register
SDIR: Instruction register
SDBSR: Boundary scan register
KAK: Dedicated emulator pin
KAK
KAK
TRST
Block Diagram
Register Descriptions
TDO
TMS
TCK
TDI
TAP controller
Figure 22.1 Block Diagram of UDI
SDBPR
MUX
Decoder
SDIR
Local
bus

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