D6417709SF167BV Renesas Electronics America, D6417709SF167BV Datasheet - Page 549

IC SUPER H MPU ROMLESS 208LQFP

D6417709SF167BV

Manufacturer Part Number
D6417709SF167BV
Description
IC SUPER H MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of D6417709SF167BV

Core Processor
SH-3
Core Size
32-Bit
Speed
167MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.75 V ~ 2.05 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D6417709SF167BV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Serial Data Transmission: The processing procedures in the smart card mode differ from
ordinary SCI processing because data is retransmitted when an error signal is sampled during a
data transmission. This results in the transmission processing flowchart shown in figure 15.6.
1. Initialize the smart card interface mode as described in Initialization above.
2. Check that the FER/ERS bit in SCSSR is cleared to 0.
3. Repeat steps 2 and 3 until the TEND flag in SCSSR is set to 1.
4. Write the transmit data into SCTDR, clear the TDRE flag to 0 and start transmitting. The
TEND flag will be cleared to 0.
5. To transmit more data, return to step 2.
6. To end transmission, clear the TE bit to 0.
This processing can be interrupted. When the TIE bit is set to 1 and interrupt requests are enabled,
a transmit-data-empty interrupt (TXI) will be requested when the TEND flag is set to 1 at the end
of transmission. When the RIE bit is set to 1 and interrupt requests are enabled, a communication
error interrupt (ERI) will be requested when the ERS flag is set to 1 when an error occurs in
transmission. See Interrupt Operation below for more information.
Rev. 5.00, 09/03, page 503 of 760

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