MC68332GVEH25 Freescale Semiconductor, MC68332GVEH25 Datasheet - Page 182

• Manufacturer Part Number: MC68332GVEH25
• Description: IC MCU 32BIT 25MHZ 132-PQFP
• Manufacturer: Freescale Semiconductor
• Series: M683xxr

Specifications of MC68332GVEH25

• Core Processor: CPU32
• Core Size: 32-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 15
• Program Memory Type: ROMless
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 132-QFP
• Processor Series: M683xx
• Core: CPU32
• Data Bus Width: 32 bit
• Controller Family/series: 68K
• No. Of I/o's: 15
• Ram Memory Size: 2KB
• Cpu Speed: 25MHz
• No. Of Timers: 1
• Embedded Interface Type: QSPI, SCI, UART
• Digital Ic Case Style: PQFP
• Rohs Compliant: Yes
• Data Ram Size: 2 KB
• Interface Type: QSPI, SCI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 15
• Number Of Timers: 16
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Request inventory verification / Request inventory verification
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

A-8
10. When V
Notes for Tables A–5 and A–5a:
1. Applies to:
2. Input-Only Pins: EXTAL, TSTME/TSC, BKPT, T2CLK, RXD
3. Does not apply to HALT and RESET because they are open drain pins. Does not apply to Port QS [7:0] (TXD,
4. Current measured with system clock frequency of 16.78 MHz, all modules active.
5. Use of an active pulldown device is recommended.
6. Total operating current is the sum of the appropriate I
7.
8. Power dissipation measured at specified system clock frequency, all modules active. Power dissipation can be
9. This parameter is periodically sampled rather than 100% tested.
the V
ification. System noise on the V
Output-Only Pins: CSBOOT, BG/CS, CLKOUT, FREEZE/QUOT, IPIPE
Input/Output Pins:
PCS[3:1],ÊPCS0/SS, SCK, MOSI, MISO) in wired-OR mode.
rents for device modules powered by V
Volt. The RAM array cannot be accessed while the module is in standby mode.
calculated using the expression:
I
DD
includes supply currents for all device modules powered by V
STBY
Port E [7:4] — SIZ[1:0], AS, DS
Port F [7:0] — IRQ[7:1], MODCLK
Port QS [7:0] — TXD, PCS[3:1],ÊPCS0/SS, SCK, MOSI, MISO
TPUCH[15:0], T2CLK
BKPT/DSCLK, IFETCH, RESET, RXD, TSTME/TSC
EXTAL (when PLL enabled)
Group 1:
Group 2:
Group 3:
Group 4:
The RAM module will not switch into standby mode as long as V
DD
and V
is transitioning during power-up or power down sequence, and V
DD
P
pins, which causes standby current to increase toward the maximum transient condition spec-
D
DATA[15:0], IFETCH, TPUCH[15:0]
Port C [6:0] — ADDR[22:19]/CS[9:6], FC[2:0]/CS[5:3]
Port E [7:0] — SIZ[1:0], AS, DS, AVEC, RMC, DSACK[1:0]
Port F [&:0] — IRQ[7:1], MODCLK
Port QS [7:3] — TXD, PCS[3:1], PCS0/SS
ADDR23/CS10/ECLK, ADDR[18:0], R/W, BERR, BR/CS0, BGACK/CS2
HALT, RESET
MISO, MOSI, SCK
Maximum V
Freescale Semiconductor, Inc.
For More Information On This Product,
DD
ELECTRICAL CHARACTERISTICS
and V
DD
Go to: www.freescale.com
(I
DDE
DD
STBY
+ I
and V
DDSYN
pins can contribute to this condition.
DDI
+ I
pins.
DD
SB
, I
)
DDSYN
, and I
DDE
SB
and V
SB
does not exceed V
values. I
SB
DDI
is applied, current flows between
pins.
DD
values include supply cur-
USER’S MANUAL
DD
by more than 0.5
MC68332