MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 41

IC MCU 32BIT E300 324TEPBGA

MPC5125YVN400

Manufacturer Part Number
MPC5125YVN400
Description
IC MCU 32BIT E300 324TEPBGA
Manufacturer
Freescale Semiconductor
Series
MPC51xxr

Specifications of MPC5125YVN400

Core Processor
e300
Core Size
32-Bit
Speed
400MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals
DMA, WDT
Number Of I /o
64
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
324-PBGA
Processor Series
MPC51xx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
Maximum Clock Frequency
400 MHz
Operating Supply Voltage
1.4 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
3.3 V
Interface Type
CAN, I2C
Minimum Operating Temperature
- 40 C
Program Memory Size
32 bit
Cpu Speed
400MHz
Embedded Interface Type
CAN, I2C, SPI, UART, USB
Digital Ic Case Style
TEPBGA
No. Of Pins
324
Rohs Compliant
Yes
Cpu Family
MPC5xx
Device Core Size
32b
Frequency (max)
400MHz
Total Internal Ram Size
32KB
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC5125YVN400
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
MPC5125YVN400
Manufacturer:
LTC
Quantity:
29
Part Number:
MPC5125YVN400
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
4.1.5
Power dissipation of the MPC5125 is caused by three different components:
Table 10
dissipation due to the switching of the IO pins cannot be given in general, but must be calculated for each application case using
the following formula:
where N is the number of output pins switching in a group M, C is the capacitance per pin, V
the switching frequency, and P
MPC5125 device must not exceed this value, which would cause the maximum junction temperature to be exceeded.
Freescale Semiconductor
Dissipation of the internal or core digital logic (supplied by V
Dissipation of the analog circuitry (supplied by AV
Dissipation of the IO logic (supplied by V
NOTES:
1
2
details typical measured core and analog power dissipation figures for a range of operating modes. However, the
Typical core power is measured at V
Operational power is measured while running an entirely cache-resident program with floating-point
multiplication instructions in parallel with DDR write operation.
Operational
Deep-sleep
Hibernation
Operational
Deep-sleep
Operational
Deep-sleep
Power Dissipation
Sleep
Doze
Mode
Nap
3
3
3
4
2
PLL/OSC Power Supplies (AV
IOint
is the power consumed by the unloaded IO stage. The total power consumption of the
Unloaded I/O Power Supplies (V
P IO
MPC5125 Microcontroller Data Sheet, Rev. 3
=
P total
e300 = 400 MHz, CSB = 200 MHz
V
P IOint
DD_IO
180
Table 10. Power Dissipation
Core Power Supply (V
5
DD_core
RTC Power Supply (V
=
DD_IO_MEM
High-Performance
+
P core
= 1.4 V, T
M
DD_SPLL
N
620
580
235
230
38
20
18
55
DD_SPLL
+
×
P analog
C
and V
J
×
= 25 °C.
, AV
VDD_IO
and AV
DD_IO
DD_IO
DD_core
DD
DD_CPLL
BAT
+
)
P IO
, V
V
)
)
DD_IO_MEM
DD_CPLL
2
)
DD_IO_MEM
1
×
, AV
40
1
f
DD_OSC_TMPS
Electrical and Thermal Characteristics
)
)
6
DD_IO
)
Unit
mW
mW
mW
mW
mW
mW
mW
mW
µW
5
µW
is the IO voltage swing, f is
SpecID
D5.10
D5.1
D5.3
D5.2
D5.4
D5.5
D5.6
D5.7
D5.8
D5.9
Eqn. 1
Eqn. 2
41

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