MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 38

• Manufacturer Part Number: MPC5125YVN400
• Description: IC MCU 32BIT E300 324TEPBGA
• Manufacturer: Freescale Semiconductor
• Series: MPC51xxr

Specifications of MPC5125YVN400

• Core Processor: e300
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, USB OTG
• Peripherals: DMA, WDT
• Number Of I /o: 64
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.33 V ~ 1.47 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 324-PBGA
• Processor Series: MPC51xx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
• Maximum Clock Frequency: 400 MHz
• Operating Supply Voltage: 1.4 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Data Ram Size: 32 KB
• I/o Voltage: 3.3 V
• Interface Type: CAN, I2C
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 32 bit
• Cpu Speed: 400MHz
• Embedded Interface Type: CAN, I2C, SPI, UART, USB
• Digital Ic Case Style: TEPBGA
• No. Of Pins: 324
• Rohs Compliant: Yes
• Cpu Family: MPC5xx
• Device Core Size: 32b
• Frequency (max): 400MHz
• Total Internal Ram Size: 32KB
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 324
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Electrical and Thermal Characteristics
38
Input high voltage
Input high voltage
Input high voltage
Input high voltage
Input high voltage
Input high voltage
Input low voltage
Input low voltage
Input low voltage
Input low voltage
Input low voltage
Input low voltage
Input low voltage
Input low voltage
Input leakage current
Input leakage current
Input leakage current
Input current, pullup
resistor
Input current,
pulldown resistor
Output high voltage
Output high voltage
Output high voltage
Output high voltage
Characteristic
6
8
SYS_XTALI crystal mode bypass
RTC_XTALI crystal mode bypass
IOH is driver dependent
SYS_XTAL_IN V
RTC_XTAL_IN V
PULLDOWN V
Input type = Schmitt V
Input type = Schmitt V
(depending on input type)
RTC_XTALI crystal mode
V
SYS_XTALI crystal mode
PULLUP V
IOH is driver dependent
IOH is driver dependent
IOH is driver dependent
Input type = TTL V
DD_IO
V
V
V
V
V
V
V
V
V
V
Input type = TTL
Input type = TTL
Input type = TTL
Input type = TTL
Input type = TTL
Input type = TTL
Input type = TTL
DD_IO_MEM_LPDDR
DD_IO_MEM_LPDDR
DD_IO_MEM_LPDDR
DD_IO_MEM_DDR2
DD_IO_MEM_DDR2
DD_IO_MEM_DDR2
bypass mode
bypass mode
DD_IO_MEM_DDR
DD_IO_MEM_DDR
DD_IO_MEM_SDR
DD_IO_MEM_SDR
/V
Table 6. DC Electrical Specifications (continued)
Condition
Vin = 0 or
DD_IO_MEM_DDR/2
mode
mode
DD_IO
MPC5125 Microcontroller Data Sheet, Rev. 3
DD_IO
in
in
= 0 or V
= 0 or V
V
in
2
4
V
DD_IO
7
in
= V
DD_IO
DD_IO
V
= V
DD_IO
DD_IO
DD_IO
IL
7
7
7
1
3
5
IH
V
V
V
OHDDR2
OHLPDD
OHDDR
CV
Sym
RV
CV
RV
I
I
V
V
V
V
V
INpu
INpd
V
V
V
V
V
V
I
I
I
IN
IN
IN
OH
R
IH
IH
IH
IH
IL
IL
IL
IL
IL
IL
IH
IH
IL
IL
(V
MVREF + 0.125
(V
(V
0.7 × V
0.7 × V
0.65 × V
DD_IO
0.8 × V
MEM – 0.28
MEM – 0.28
MEM_LPDDR
Vxtal + 0.4
BAT
BAT
VDD_IO_
VDD_IO_
MEM_SDR
−2.5
1.94
Min
/ 5) + 0.5
/ 2) + 0.4
25
25
—
—
—
—
—
—
—
—
—
—
/ 2) + 0.4
DD_IO_
DD_IO_
DD_IO
DD_IO
(V
MV
0.42 × V
MV
0.35 × V
(V
(V
0.3 × V
0.3 × V
Vxtal – 0.4 ×
MEM_LPDDR
DD_IO
BAT
BAT
MEM_SDR
REF
REF
Max
150
150
2.5
1.0
/5) – 0.5
/2) – 0.4
20
—
—
—
—
—
—
—
—
—
—
/2) – 0.4
– 0.125
DD_IO_
DD_IO_
Freescale Semiconductor
– 0.15
DD_IO
DD_IO
Unit SpecID
µA
µA
µA
µA
µA
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
D3.33
D3.10
D3.11
D3.34
D3.12
D3.13
D3.14
D3.15
D3.16
D3.17
D3.18
D3.19
D3.20
D3.21
D3.22
D3.23
D3.3
D3.4
D3.5
D3.6
D3.7
D3.8
D3.9