MC56F8147VPYE Freescale Semiconductor, MC56F8147VPYE Datasheet - Page 162

IC DSP 16BIT 40MHZ 160-LQFP

MC56F8147VPYE

Manufacturer Part Number
MC56F8147VPYE
Description
IC DSP 16BIT 40MHZ 160-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheet

Specifications of MC56F8147VPYE

Core Processor
56800
Core Size
16-Bit
Speed
40MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
76
Program Memory Size
128KB (64K x 16)
Program Memory Type
FLASH
Ram Size
4K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
160-LQFP
Data Bus Width
16 bit
Processor Series
MC56F81xx
Core
56800E
Data Ram Size
4 KB
Interface Type
SPI, SCI, CAN
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
76
Number Of Timers
2
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
4 x 12 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC56F8147VPYE
Manufacturer:
FREESCAL
Quantity:
253
Part Number:
MC56F8147VPYE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Please see http://www.freescale.com for the most current mechanical drawing.
162
13X
160X
e
X
3
S
Y
E
b
0.30
0.10 Z
14 13 12 11 10
Z
X
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
Y
0.20
Figure 11-3 160 MAPBGA Mechanical Information
VIEW M-M
9
D
6
13X
S
5
e
4
56F8347 Technical Data, Rev.11
3
2
1
CASE 1268-01
G
H
K
M
ISSUE O
A
B
C
D
E
F
L
N
P
J
METALIZED MARK FOR
PIN 1 IDENTIFICATION
IN THIS AREA
K
M
A
A2
A1
ROTATED 90 CLOCKWISE
NOTES:
1.
2.
3.
4.
5.
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
Z
DETAIL K
DIM MIN
A1
A2
A
b
D
E
S
e
MILLIMETERS
°
4
1.32
0.27
0.35
15.00 BSC
15.00 BSC
1.00 BSC
0.50 BSC
1.18 REF
Freescale Semiconductor
MAX
1.75
0.47
0.65
DATE 04/06/98
0.15 Z
160X
5
0.30 Z
Preliminary

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