C8051F526-IMR Silicon Labs, C8051F526-IMR Datasheet - Page 51

• Manufacturer Part Number: C8051F526-IMR
• Description: 8-bit Microcontrollers - MCU 2KB 12ADC 125C LIN 10Pin MCU
• Manufacturer: Silicon Labs

Specifications of C8051F526-IMR

• Product Category: 8-bit Microcontrollers - MCU
• Rohs: yes
• Core: 8051
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 25 MHz
• Program Memory Size: 2 KB
• Data Ram Size: 256 B
• On-chip Adc: Yes
• Package / Case: DFN-10
• Mounting Style: SMD/SMT
• A/d Bit Size: 12 bit
• A/d Channels Available: 6
• Interface Type: SPI, UART
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 6
• Number Of Timers: 3
• On-chip Dac: No
• Processor Series: C8051
• Program Memory Type: Flash
• Factory Pack Quantity: 1500
• Supply Voltage - Max: 2.7 V, 5.25 V
• Supply Voltage - Min: 2 V, 2.7 V

Table 3.9. QFN-20 Landing Diagram Dimensions
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD).
4. A stainless steel, laser-cut and electro-polished stencil with
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all
7. A 2x2 array of 1.10 x 1.10 mm openings on 1.30 mm pitch should be
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-
Symbol
noted.
Clearance between the solder mask and the metal pad is to be
60 µm minimum, all the way around the pad.
trapezoidal walls should be used to assure good solder paste
release.
perimeter pads.
used for the center ground pad.
020 specification for Small Body Components.
C1
C2
X1
X2
Y1
Y2
E
Rev. 1.4
3.90
3.90
0.20
2.75
0.65
2.75
Min
0.50 BSC.
C8051F52x/F53x
Max
4.00
4.00
0.30
2.85
0.75
2.85
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