W25Q80BVSSIG Winbond Electronics, W25Q80BVSSIG Datasheet - Page 74

• Manufacturer Part Number: W25Q80BVSSIG
• Description: IC FLASH 8MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q80BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 8M (1M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q4816329; T1015683

12.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q80BV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-
digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages
use an abbreviated 10-digit number.
Part Numbers for Industrial Temperature:
Part Numbers for Automotive Temperature
Notes:
1.
2.
3.
PACKAGE TYPE
PACKAGE TYPE
WSON-8 6x5mm
WSON-8 6x5mm
SOIC-8 150mil
SOIC-8 208mil
SOIC-8 150mil
SOIC-8 208mil
PDIP-8 300mil
PDIP-8 300mil
For WSON packages, the package type ZP is not used in the top side marking.
Package type SN (SOIC8 150mil) is a special order package, please contact Winbond for ordering information.
For Automotive Temperature parts, please contact Winbond for availability.
SN
SN
ZP
ZP
DA
DA
SS
SS
(1)
(1)
(2)
(2)
DENSITY
DENSITY
8M-bit
8M-bit
8M-bit
8M-bit
8M-bit
8M-bit
8M-bit
8M-bit
(3)
:
PRODUCT NUMBER
PRODUCT NUMBER
W25Q80BVSNAG
W25Q80BVDAAG
W25Q80BVSNAP
W25Q80BVSSAG
W25Q80BVZPAG
W25Q80BVDAAP
W25Q80BVSSAP
W25Q80BVZPAP
W25Q80BVSNIG
W25Q80BVSSIG
W25Q80BVDAIG
W25Q80BVSNIP
W25Q80BVSSIP
W25Q80BVZPIG
W25Q80BVDAIP
W25Q80BVZPIP
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TOP SIDE MARKING
TOP SIDE MARKING
25Q80BVNAG
25Q80BVNAP
25Q80BVSAG
25Q80BVAAG
25Q80BVSAP
25Q80BVAAP
25Q80BVNIG
25Q80BVSIG
25Q80BVAIG
25Q80BVNIP
25Q80BVAIP
25Q80BVSIP
25Q80BVAG
25Q80BVAP
25Q80BVIG
25Q80BVIP
W25Q80BV