W25Q80BVSSIG Winbond Electronics, W25Q80BVSSIG Datasheet - Page 54
W25Q80BVSSIG
Manufacturer Part Number
W25Q80BVSSIG
Description
IC FLASH 8MBIT 8SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25Q80BVSSIG.pdf
(75 pages)
Specifications of W25Q80BVSSIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
8M (1M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q4816329
T1015683
T1015683
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
W25Q80BVSSIG
Manufacturer:
Winbond
Quantity:
2 100
Company:
Part Number:
W25Q80BVSSIG
Manufacturer:
WINBOND
Quantity:
192
Part Number:
W25Q80BVSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
9.2.35
For compatibility reasons, the W25Q80BV provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin
low and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh)
and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the
falling edge of CLK with most significant bit (MSB) first as shown in figure 33. For memory type and
capacity values refer to Manufacturer and Device Identification table.
Read JEDEC ID (9Fh)
(IO
(IO
(IO
(IO
CLK
CLK
/CS
/CS
DO
DO
DI
DI
0
1
0
1
)
)
)
)
Mode 3
Mode 0
15
*
*
= MSB
7
16
6
17
0
Memory Type ID15-8
5
18
1
Figure 33. Read JEDEC ID Instruction Sequence
4
19
Instruction (9Fh)
High Impedance
2
3
20
3
2
21
4
1
22
5
- 54 -
0
23
6
*
7
24
7
6
25
8
5
26
Capacity ID7-0
9
Manufacturer ID (EFh)
4
27
10
3
28
11
2
29
12
1
30
13
0
W25Q80BV
14
Mode 3
Mode 0
15