MSC8157ETVT1000A Freescale Semiconductor, MSC8157ETVT1000A Datasheet - Page 54

• Manufacturer Part Number: MSC8157ETVT1000A
• Description: Digital Signal Processors & Controllers - DSP, DSC Qual 8157 EN FG 1GHz -45 to 105c
• Manufacturer: Freescale Semiconductor

Specifications of MSC8157ETVT1000A

• Rohs: yes
• Core: SC3850
• Data Bus Width: 32 bit
• Program Memory Size: 32 KB
• Data Ram Size: 512 KB
• Number Of Programmable I/os: 32
• Number Of Timers: 2
• Operating Supply Voltage: 0.97 V to 1.05 V
• Maximum Operating Temperature: + 105 C
• Package / Case: FCPBGA-783
• Mounting Style: SMD/SMT

CLKIN/MCLKIN duty cycle
CLKIN/MCLKIN slew rate
CLKIN/MCLKIN peak period jitter
CLKIN/MCLKIN jitter phase noise at –56 dBc
AC input swing limits
Input capacitance
Notes:
Electrical Characteristics
3.3
Table 5
3.4
Table 6
3.5
This section describes the DC electrical characteristics for the MSC8157.
54
Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board (bottom)
Junction-to-case
Notes:
describes thermal characteristics of the MSC8157 for the FC-PBGA packages.
summarizes the required characteristics for the CLKIN/MCLKIN signal.
1.
2.
3.
4.
5.
1.
2.
3.
4.
Parameter/Condition
Thermal Characteristics
CLKIN/MCLKIN Requirements
DC Electrical Characteristics
For clock frequencies, see the Clock chapter in the MSC8157 Reference Manual.
Measured at the rising edge and/or the falling edge at V
Slew rate as measured from ±20% to 80% of voltage swing at clock input.
Phase noise is calculated as FFT of TIE jitter.
The specified capacitance is not an external requirement. It represents the internal capacitance specification.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESDC51-6. Thermal test board meets JEDEC
specification for the specified package.
Junction-to-board thermal resistance determined per JEDEC JESD 51-8. Thermal test board meets JEDEC specification for
the specified package.
Junction-to-case at the top of the package determined using MIL- STD-883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer
4
Characteristic
1, 2
3
MSC8157 Six-Core Digital Signal Processor Data Sheet, Rev. 1
1
Table 5. Thermal Characteristics for the MSC8157
1, 2
Table 6. CLKIN/MCLKIN Requirements
Symbol
ΔV
C
—
—
—
—
IN
AC
Symbol
R
R
R
R
θJA
θJA
θJB
θJC
DDIO
Min
1.5
40
—
—
—
1
/2.
Convection
Typ
—
—
—
—
—
—
Natural
0.4
18
13
4
29
FC-PBGA
×
±150
Max
500
29 mm
60
15
—
4
(1 m/s) airflow
200 ft/min
2
Freescale Semiconductor
12
9
V/ns
Unit
KHz
ps
%
pf
V
Notes
°C/W
°C/W
°C/W
°C/W
Unit
—
—
2
3
4
5