MPC603RRX266TC Freescale Semiconductor, MPC603RRX266TC Datasheet - Page 4

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MPC603RRX266TC

Manufacturer Part Number
MPC603RRX266TC
Description
IC MPU 32BIT 266MHZ 255-CBGA
Manufacturer
Freescale Semiconductor
Datasheets

Specifications of MPC603RRX266TC

Processor Type
MPC603e PowerPC 32-Bit
Speed
266MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
255-CBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC603RRX266TC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1.3 General Parameters
The following list provides a summary of the general parameters of the PID7t-603e:
General Parameters
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Technology
Die size
Transistor count
Logic design
Package
Core power supply
I/O power supply
Ñ 16-Kbyte instruction cacheÑfour-way set-associative, physically addressed; LRU replacement
Ñ Cache write-back or write-through operation programmable on a per page or per block basis
Ñ BPU that performs CR lookahead operations
Ñ Address translation facilities for 4-Kbyte page size, variable block size, and 256-Mbyte
Ñ A 64-entry, two-way set-associative ITLB
Ñ A 64-entry, two-way set-associative DTLB
Ñ Four-entry data and instruction BAT arrays providing 128-Kbyte to 256-Mbyte blocks
Ñ Software table search operations and updates supported through fast trap mechanism
Ñ 52-bit virtual address; 32-bit physical address
Facilities for enhanced system performance
Ñ A 32- or 64-bit split-transaction external data bus with burst transfers
Ñ Support for one-level address pipelining and out-of-order bus transactions
Integrated power management
Ñ Low-power 2.5/3.3-volt design
Ñ Internal processor/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 4.5:1, 5:1,
Ñ Three power saving modes: doze, nap, and sleep
Ñ Automatic dynamic power reduction when internal functional units are idle
In-system testability and debugging features through JTAG boundary-scan capability
algorithm
segment size
5.5:1, and 6:1 ratios
Freescale Semiconductor, Inc.
For More Information On This Product,
0.29
5.65 mm x 7.7 mm (44 mm
2.6 million
Fully-static
255 ceramic ball grid array (CBGA)
or 225 thin map plastic ball grid array (PBGA)
2.5 ± 5% V dc
3.3 ± 5% V dc
PID7t-603e Hardware Specifications
µ
m CMOS, Þve-layer metal
Go to: www.freescale.com
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