MPC603RRX266TC Freescale Semiconductor, MPC603RRX266TC Datasheet - Page 29

• Manufacturer Part Number: MPC603RRX266TC
• Description: IC MPU 32BIT 266MHZ 255-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC603RRX266TC

• Processor Type: MPC603e PowerPC 32-Bit
• Speed: 266MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 255-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

1.8.6.2 Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 17 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, ßoroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease signiÞcantly reduces the interface thermal resistance. That is, the bare joint results
in a thermal resistance approximately 7 times greater than the thermal grease joint. Therefore, the synthetic
grease offers the best thermal performance, considering the low interface pressure. Of course, the selection
of any thermal interface material depends on many factorsÑthermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.
External Resistance
External Resistance
Internal Resistance
Figure 16. Package with Heat Sink Mounted to a Printed-Circuit Board
Freescale Semiconductor, Inc.
For More Information On This Product,
Printed-Circuit Board
PID7t-603e Hardware Specifications
(Note the internal versus external package resistance)
Heat Sink
Go to: www.freescale.com
Radiation
Radiation
Convection
Convection
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
System Design Information
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