MPC603RRX266TC Freescale Semiconductor, MPC603RRX266TC Datasheet - Page 22

• Manufacturer Part Number: MPC603RRX266TC
• Description: IC MPU 32BIT 266MHZ 255-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC603RRX266TC

• Processor Type: MPC603e PowerPC 32-Bit
• Speed: 266MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 255-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

Figure 12 shows the JEDEC package dimensions of the PBGA package.
Note that the pin numberings shown in Figure 12 do not match Table 11 and the pinout of the non-JEDEC
standard package (and the CBGA pinout) shown in Figure 11. Figure 11 should be used in conjunction with
Table 11 for the complete pinout description.
Package Descriptions
22
C
A1
A
Figure 12. Package Dimensions for the Plastic Ball Grid Array (PBGA)ÑJEDEC Standard
SIDE VIEW
256X
SEATING
PLANE
A2
A3
0.35 C
0.20 C
4X
(E1)
0.20
4X
Freescale Semiconductor, Inc.
15X
E
e /2
B
For More Information On This Product,
A
e
E2
PID7t-603e Hardware Specifications
BOTTOM VIEW
2
Go to: www.freescale.com
3
4
5
CASE 1167-01
6
7
TOP VIEW
8 9 10 11 12 13 14 15 16
(D1)
D2
15X
D
256X
e
0.30
0.15
b
M
M
17
C A B
C
M
G
U
T
R
P
N
L
K
J
H
F
E
D
C
B
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO
PRIMARY DATUM C.
PRIMARY DATUM C AND THE SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
DIM
A1
A2
A3
D1
D2
E1
E2
A
D
E
b
e
19.40
19.40
MILLIMETERS
MIN
2.10
1.10
0.50
0.50
0.60
23.00 BSC
19.05 REF
23.00 BSC
19.05 REF
1.27 BSC
19.60
19.60
MAX
2.60
0.70
1.20
0.70
0.90