MPC603RRX266TC Freescale Semiconductor, MPC603RRX266TC Datasheet - Page 21

• Manufacturer Part Number: MPC603RRX266TC
• Description: IC MPU 32BIT 266MHZ 255-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC603RRX266TC

• Processor Type: MPC603e PowerPC 32-Bit
• Speed: 266MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 255-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

1.7.2.2 Mechanical Dimensions of the PBGA Package
Figure 11 shows the non-JEDEC package mechanical dimensions and bottom surface nomenclature of the
the PBGA package.
Note that Table 11 lists the pinout to this non-JEDEC standard in order to be consistent with the CBGA
pinout.
C
A1
Figure 11. Package Dimensions for the Plastic Ball Grid Array (PBGA)Ñnon-JEDEC Standard
A
SIDE VIEW
256X
SEATING
PLANE
A2
A3
0.35 C
0.20 C
4X
(E1)
0.20
4X
Freescale Semiconductor, Inc.
15X
E
e /2
B
For More Information On This Product,
A
e
E2
PID7t-603e Hardware Specifications
BOTTOM VIEW
1
Go to: www.freescale.com
2
3
4
5
6
TOP VIEW
7 8 9 10 11 12 13 14 15
(D1)
D2
15X
D
256X
e
0.30
0.15
b
M
M
16
C A B
C
M
G
T
R
P
N
L
K
J
H
F
E
D
C
B
A
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO
PRIMARY DATUM C.
PRIMARY DATUM C AND THE SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
DIM
A1
A2
A3
D1
D2
E1
E2
A
D
E
b
e
19.40
19.40
MILLIMETERS
MIN
Package Descriptions
2.10
1.10
0.50
0.50
0.60
23.00 BSC
19.05 REF
23.00 BSC
19.05 REF
1.27 BSC
19.60
19.60
MAX
2.60
0.70
1.20
0.70
0.90
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