MPC603RRX266TC Freescale Semiconductor, MPC603RRX266TC Datasheet - Page 31

• Manufacturer Part Number: MPC603RRX266TC
• Description: IC MPU 32BIT 266MHZ 255-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC603RRX266TC

• Processor Type: MPC603e PowerPC 32-Bit
• Speed: 266MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 255-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

1.8.6.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Where:
During operation the die-junction temperatures (T
Table 3. The temperature of the air cooling the component greatly depends upon the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (T
range of 5 to 10 ¡C. The thermal resistance of the thermal interface material (q
Assuming a T
Watts, the following expression for T
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (R
velocity is shown in Figure 18.
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Die-junction temperature: T
T
T
T
q
q
q
P
T
a
jc
int
sa
d
j
r
is the die-junction temperature
j
is the air temperature rise within the computer cabinet
is the inlet cabinet ambient temperature
is the power dissipated by the device
is the die junction-to-case thermal resistance
is the heat sink base-to-ambient thermal resistance
= T
is the adhesive or interface material thermal resistance
a
a
a
of 30 ¡C, a T
) may range from 30 to 40 ¡C. The air temperature rise within a cabinet (T
+ T
r
+ (q
jc
+ q
Freescale Semiconductor, Inc.
r
of 5 ¡C a CBGA package q
For More Information On This Product,
int
PID7t-603e Hardware Specifications
+ q
j
j
= 30 ¡C + 5 ¡C + (0.095 ¡C/W + 1.0 ¡C/W + R
sa
is obtained:
) * P
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d
j
) should be maintained less than the value speciÞed in
860-571-5100
jc
=
0.095
, and a power consumption (P
System Design Information
int
) is typically about 1 ¡C/W.
sa
) * 3.0 W
sa
) versus airßow
r
) may be in the
d
) of 3.0
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