MPC603RRX266TC Freescale Semiconductor, MPC603RRX266TC Datasheet - Page 32

• Manufacturer Part Number: MPC603RRX266TC
• Description: IC MPU 32BIT 266MHZ 255-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC603RRX266TC

• Processor Type: MPC603e PowerPC 32-Bit
• Speed: 266MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 255-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

Assuming an air velocity of 0.5 m/s, we have an effective R
resulting in a die-junction temperature of approximately 60 ¡C which is well within the maximum operating
temperature of the component.
For a PBGA package, and assuming a T
consumption (P
Assuming an air velocity of 0.5 m/s, we have an effective R
resulting in a die-junction temperature of approximately 83 ¡C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, WakeÞeld Engineering, and Aavid
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need air ßow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
Þgure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat ßow. The Þnal die-junction
operating temperature, is not only a function of the component-level thermal resistance, but the system-level
System Design Information
32
Figure 18. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
T
Die-junction temperature: T
T
j
j
= 30¡C + 5¡C + (0.095 ¡C/W +1.0 ¡C/W + 7 ¡C/W) * 3.0 W,
= 30¡C + 5¡C + (8 ¡C/W +1.0 ¡C/W + 7 ¡C/W) * 3.0 W,
8
7
6
5
4
3
2
1
d
) of 3.0 Watts, the following expression for T
0
0.5
Freescale Semiconductor, Inc.
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j
1
= 30 ¡C + 5 ¡C + (8 ¡C/W + 1.0 ¡C/W + R
Approach Air Velocity (m/s)
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a
of 30 ¡C, a T
1.5
Thermalloy #2328B Pin-fin Heat Sink
2
(25 x28 x 15 mm)
r
of 5 ¡C a PBGA package q
sa
sa
j
of 7 ¡C/W, thus
of 7 ¡C/W, thus
is obtained:
2.5
3
sa
) * 3.0 W
3.5
jc
= 8, and a power