MPC603RRX266TC Freescale Semiconductor, MPC603RRX266TC Datasheet - Page 20

• Manufacturer Part Number: MPC603RRX266TC
• Description: IC MPU 32BIT 266MHZ 255-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC603RRX266TC

• Processor Type: MPC603e PowerPC 32-Bit
• Speed: 266MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 255-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

1.7.2 PBGA Package Description
The following sections provide the package parameters and mechanical dimensions for the PBGA package.
1.7.2.1 Package Parameters
The package parameters are as provided in the following list. The package type is 23 mm x 23 mm, 255-lead
plastic ball grid array (PBGA).
Package Descriptions
20
Package outline
Interconnects
Pitch
Package height
Ball diameter
Maximum heat sink force
Freescale Semiconductor, Inc.
For More Information On This Product,
23 mm x 23 mm
255
1.27 mm (50 mil)
Minimum: 2.1 mm
Maximum: 2.6 mm
0.76 mm (30 mil)
5 lbs
PID7t-603e Hardware Specifications
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