MPC603RRX266TC Freescale Semiconductor, MPC603RRX266TC Datasheet - Page 30

• Manufacturer Part Number: MPC603RRX266TC
• Description: IC MPU 32BIT 266MHZ 255-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC603RRX266TC

• Processor Type: MPC603e PowerPC 32-Bit
• Speed: 266MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 255-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
System Design Information
30
Dow-Corning Corporation
Dow-Corning Electronic Materials
PO Box 0997
Midland, MI 48686-0997
Internet: www.dow.com
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4014
Internet: www.chomerics.com
Thermagon Inc.
3256 West 25th Street
Cleveland, OH 44109-1668
Internet: www.thermagon.com
1.5
0.5
2
1
0
Figure 17. Thermal Performance of Select Thermal Interface Material
0
10
Freescale Semiconductor, Inc.
For More Information On This Product,
PID7t-603e Hardware Specifications
20
Go to: www.freescale.com
Contact Pressure (psi)
30
40
800-248-2481
781-935-4850
888-246-9050
50
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
60
70
80