MPC603RRX266TC Freescale Semiconductor, MPC603RRX266TC Datasheet - Page 26

• Manufacturer Part Number: MPC603RRX266TC
• Description: IC MPU 32BIT 266MHZ 255-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC603RRX266TC

• Processor Type: MPC603e PowerPC 32-Bit
• Speed: 266MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 255-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

To reduce the die-junction temperature, heat sinks may be attached to the package by several
methodsÑadhesive, spring clip to holes in the printed-circuit board or package, and mounting clip and
screw assembly (both CBGA and PGBA packages); see Figure 15. Caution: please note, when choosing a
heat sink attachment method, any attachment mechanism should not degrade the package structural integrity
and/or the package-to-board interconnect reliability. For additional general information, see this
paper--Investigation of Heat Sink Attach Methodologies and the Effects on Package Structural Integrity and
Interconnect Reliability.
System Design Information
26
Figure 14. Typical Die Junction-to-Ambient Thermal Resistance
4 0
3 5
3 0
2 5
2 0
1 5
1 0
5
0
0
Freescale Semiconductor, Inc.
For More Information On This Product,
(21 mm CBGA and 23 mm WB-PBGA)
PID7t-603e Hardware Specifications
Air flow Velocit y ( m/ s )
0.5
Go to: www.freescale.com
Typical Upper Limit
Typical Lower Limit
1
1.5
2