GCIXP1250BC 837414 Intel, GCIXP1250BC 837414 Datasheet - Page 72

• Manufacturer Part Number: GCIXP1250BC 837414
• Manufacturer: Intel

Specifications of GCIXP1250BC 837414

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Intel
4.2.2
4.2.3
72
Table 36. I2 and O2 Pin Types
Table 37. Overshoot/Undershoot Specifications
®
IXP1250 Network Processor
Note: In
Type 2 Driver DC Specifications
Table 36
1. Input leakage currents include high impedance output leakage for all bidirectional buffers with tri-state outputs.
Currents from the chip (chip sourcing) are denoted as negative(-) current. Input leakage currents
include high-Z output leakage for all bidirectional buffers with tri-state outputs. The electrical
specifications are preliminary and subject to change.
Overshoot/Undershoot Specifications
The IXP1250 has been designed to be tolerant of overshoot and undershoot associated with normal
I/O switching. However, excessive overshoot or undershoot of I/O signals can cause the device to
latchup.
V
V
V
V
I
C
I1/O1
I2/O2
O3
O4
O5
i
ih
il
oh
ol
in
Table 35
Symbol
Pin Type
Table 37
refers to pin types: I2, O2.
and
Table
specifies limits on I/O overshoot and undershoot that should never be exceeded.
Input High Voltage
Input Low Voltage
Output High
Voltage
Output Low Voltage
Input Leakage
Current
Pin Capacitance
36, currents into the chip (chip sinking) are denoted as positive(+) current.
-0.75 V
-0.7 V
-0.7 V
-0.75 V
-0.7 V
Parameter
Undershoot
1
Ioh = -500 uA
Iol = 1500 uA
0
Vin
Condition
VDDX + 0.7 V
VDDX + 0.65 V
VDDX + 0.6 V
VDDX + 1.0 V
VDDX + 0.65 V
VDDX
Overshoot
0.5 x VDDX
---
0.9 x VDDX
---
-10 A
5 pF
Minimum
4 ns
4 ns
4 ns
4 ns
4 ns
Maximum Duration
VDD_REF + 0.5 V
0.3 x VDDX
---
0.1 x VDDX
10 A
10 pF
Maximum
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