GCIXP1250BC 837414 Intel, GCIXP1250BC 837414 Datasheet - Page 147

• Manufacturer Part Number: GCIXP1250BC 837414
• Manufacturer: Intel

Specifications of GCIXP1250BC 837414

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5.2
Datasheet
Table 53. IXP1250 Package Dimensions (mm)
IXP1250 Package Dimensions (mm)
A
A1
A2
D
D1
E
E1
M, N
M1 [6]
b
d
e
aaa
bbb
ccc
ddd
S
T
V
NOTES:
All notes are related to
Unless otherwise specified:
1. All dimensions and tolerances conform to ANSI Y1.45M-1994.
2. Dimension “d” is measured at the maximum solder ball diameter parallel to primary datum “c”.
3. Primary datum “c” and seating plane are defined by the spherical crowns of the solder balls.
4. Pin A1 I.D. marked by laser.
5. Shape at corner, single form.
6. Number of rows in from edge to center.
7. Seating plane clearance: Minimum height of encapuslant above seating plane.
8. S is measured with respect to -A- and -B- and defines the position of the center solder ball in the outer row.
9. Equivalent to ANAM P/N 71290
When there is an odd number of solder balls in the outer row, S=0.000; when there is an even number of
solder balls in the outer row, the value S=e/2. S can be either 0.000 or e/2 for each variation.
Symbol
Overall thickness
Ball height
Body thickness
Body size
Ball footprint
Body size
Ball footprint
Ball Matrix
Number of rows deep
Ball diameter
Minimum distance encap to balls
Ball pitch
Package body profile
Parallel
Encap flatness over die
Coplanarity
Solder ball placement
V-score web thickness
V-score bottome size
Figure 82
Definition
through
Figure
84. All dimensions are in millimeters.
—
0.50
0.80
—
38.00
—
38.00
—
—
0.60
0.25
—
—
—
—
—
—
0.050
39.2
Minimum
Intel
®
IXP1250 Network Processor
—
0.60
0.91
40.00
38.10
40.00
38.10
31 x 31
5
0.75
—
1.27
—
—
—
—
0.00
0.125
—
Nominal
1.70
0.70
1.00
—
38.20
—
38.20
—
—
0.90
—
—
0.20
0.25
0.10
0.20
—
0.175
39.9
Maximum
147