MC9S08GB60ACFUE Freescale, MC9S08GB60ACFUE Datasheet - Page 103

• Manufacturer Part Number: MC9S08GB60ACFUE
• Manufacturer: Freescale

Specifications of MC9S08GB60ACFUE

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 56
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8/2.08V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 60KB
• Lead Free Status / RoHS Status: Compliant

Chapter 7
Internal Clock Generator (S08ICGV2)
The MC9S08GBxxA/GTxxA microcontroller provides one internal clock generation (ICG) module to
create the system bus frequency. All functions described in this section are available on the
MC9S08GBxxA/GTxxA microcontroller. The EXTAL and XTAL pins share port G bits 2 and 1,
respectively. Analog supply lines V
pins. Electrical parametric data for the ICG may be found in
Freescale Semiconductor
ICG
ICGLCLK*
ICGERCLK
FFE
Freescale Semiconductor recommends that flash location $FFBE be
reserved to store a nonvolatile version of ICGTRM. This will allow
debugger and programmer vendors to perform a manual trim operation and
store the resultant ICGTRM value for users to access at a later time.
ICGOUT
* ICGLCLK is the alternate BDC clock source for the MC9S08GBxxA/GTxxA.
CPU
÷
CONTROL
2
SYSTEM
LOGIC
÷
2
FIXED FREQ CLOCK (XCLK)
Figure 7-1. System Clock Distribution Diagram
RTI
BUSCLK
DDA
MC9S08GB60A Data Sheet, Rev. 2
and V
BDC
TPM1
SSA
NOTE
are internally derived from the MCU’s V
TPM2
Appendix A, “Electrical
ATD has min and max
frequency requirements. See
Chapter 1, “Device
Appendix A, “Electrical
IIC1
ATD1
SCI1
Overview” and
Characteristics.
RAM
SCI2
Characteristics.”
Flash has frequency
requirements for program
and erase operation.
See
Characteristics.
Appendix A, “Electrical
FLASH
DD
SPI1
and V
SS
103