RG82845G S L66F Intel, RG82845G S L66F Datasheet - Page 170

• Manufacturer Part Number: RG82845G S L66F
• Manufacturer: Intel

Specifications of RG82845G S L66F

• Lead Free Status / RoHS Status: Not Compliant

Ballout and Package Information
7.2
170
Figure 7-3. Intel
Package Information
The GMCH is in a 37.5 mm x 37.5 mm FC-BGA package with 1 mm ball pitch.
show the package dimensions.
ϕ 0.6500 ±0.05
Units = Millimeters
®
ϕ 0.500
82845G GMCH Package Dimensions (Top and Side Views)
37.50 ±0.05
0.203
Detail A
18.75 17.9250
C
A
16.9500
Detail B
Detail A
B
0.500 ±0.070
ϕ 1.1500 ±0.05
ϕ 1.00
0.203
Detail B
Substrate
17.9250
16.9500
C
A
Intel
B
37.50 ±0.050
®
Top View
0.57 ±0.1
3 x 0.07
82845G/82845GL/82845GV GMCH Datasheet
Side View
Detail C
Die
18.75
0.57 ±0.1
1.5 ±0.05
See Detail D
0.74 ±0.025
Figure 7-3
0.100 ±0.025
Detail D
and
Detail A
Detail C
1.08 ±0.06
A
Figure 7-4
Die Solder
Bumps
0.200
Underfill
Epoxy