MT4VDDT3232UY-6K1 Micron Technology Inc, MT4VDDT3232UY-6K1 Datasheet - Page 26
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MT4VDDT3232UY-6K1
Manufacturer Part Number
MT4VDDT3232UY-6K1
Description
MODULE DDR 128MB 167MHZ 172-DIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT4VDDT3232UY-6K1.pdf
(27 pages)
Specifications of MT4VDDT3232UY-6K1
Memory Type
DDR SDRAM
Memory Size
128MB
Speed
333MT/s
Package / Case
172-UDIMM
Main Category
DRAM Module
Sub-category
DDR SDRAM
Module Type
100UDIMM
Device Core Size
32b
Organization
32Mx32
Total Density
128MByte
Chip Density
256Mb
Access Time (max)
700ps
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Operating Current
700mA
Number Of Elements
4
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
100
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Table 20: Serial Presence-Detect Matrix (Continued)
“1”/“0”: Serial Data, “driven to HIGH”/“driven to LOW”; notes appear on page 26
NOTE:
pdf: 09005aef808da768, source: 09005aef808d2e9a
DD4C16_32x32UG.fm - Rev. D 9/04 EN
3. The value of
99-127 Manufacturer-specific Data (RSVD)
1. The value of
2. The JEDEC SPD specification allows fast or slow slew rate values for these bytes. The worst-case (slow slew rate) value is
48–61 Reserved
BYTE
36-40 Reserved
65-71 Manufacturer’s JEDEC ID Code
73-90 Module Part Number (ASCII)
95-98 Module Serial Number
SDRAM device specification is 15ns.
33
34
35
41
42
43
44
45
46
47
62
63
64
72
91
92
93
94
represented here. Systems requiring the fast slew rate setup and hold values are supported, provided the faster min-
imim slew rate is met.
Address and Command Hold Time,
note 2)
Data/Data Mask Input Setup Time,
Data/Data Mask Input Hold Time,
Min Active Auto Refresh Time,
Minimum Auto Refresh to Active/Auto Refresh
Command Period,
SDRAM Device Max Cycle Time,
SDRAM Device Max DQS-DQ Skew Time,
SDRAM Device Max Read Data Hold Skew
Factor,
Reserved
DIMM Height
SPD Revision
Checksum for Bytes 0-62
Manufacturer’s JEDEC ID Code
Manufacturing Location
Pcb Identification Code
Identification Code (Continued)
Year of Manufacture in BCD
Week of Manufacture in BCD
t
t
t
RP,
QHS
RAS used for -75 modules is calculated from
t
RCD and
DESCRIPTION
t
RFC
t
RAP for -335 modules indicated as 18ns to align with industry specifications; actual DDR
t
RC (see note 3)
t
CK
t
DH
t
t
MAX
DS
IH (See
t
DQSQ
ENTRY (VERSION)
26
0.75ns (-75Z/-75)
1.0ns (-75Z/-75)
0.5ns (-75Z/-75)
0.5ns (-75Z/-75)
0.5ns (-75Z/-75)
65ns (-75Z/-75)
75ns (-75Z/-75)
13ns (-75Z/-75)
t
RC -
(Continued)
Release 1.0
0.45ns (-6)
0.45ns (-6)
0.45ns (-6)
0.55ns (-6)
0.8ns (-6)
60ns (-6)
72ns (-6)
12ns (-6)
MICRON
01–12
-75Z
t
-75
1-9
RP. Actual device spec. value is 40 ns.
-6
0
Micron Technology, Inc., reserves the right to change products or specifications without notice.
64MB, 128MB (x32, SR)
MT4VDDT1632U
Variable Data
Variable Data
Variable Data
Variable Data
100-PIN DDR UDIMM
01–0C
01-09
A0
2D
D4
80
45
50
45
50
00
3C
41
48
4B
30
34
3C
55
75
00
01
00
10
94
C4
2C
00
FF
–
©2004 Micron Technology, Inc. All rights reserved.
MT4VDDT3232U
Variable Data
Variable Data
Variable Data
Variable Data
01–0C
01-09
A0
2D
A7
D7
80
45
50
45
50
00
3C
41
48
4B
30
34
3C
55
75
00
01
00
10
E7
2C
00
FF
–