MT46H8M32LFB5-75:A TR Micron Technology Inc, MT46H8M32LFB5-75:A TR Datasheet - Page 79
![IC DDR SDRAM 256MBIT 90VFBGA](/photos/7/23/72313/mfg557-90-vfbga_sml.jpg)
MT46H8M32LFB5-75:A TR
Manufacturer Part Number
MT46H8M32LFB5-75:A TR
Description
IC DDR SDRAM 256MBIT 90VFBGA
Manufacturer
Micron Technology Inc
Datasheet
1.MT46H16M16LFBF-6A_TR.pdf
(79 pages)
Specifications of MT46H8M32LFB5-75:A TR
Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
256M (8Mx32)
Speed
133MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
0°C ~ 70°C
Package / Case
90-VFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
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Figure 51:
PDF: 09005aef82091978 / Source: 09005aef8209195b
MT46H16M16LF__2.fm - Rev. H 6/08 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth
Dimensions apply
to solder balls post-
reflow. Pre-reflow
balls are Ø0.42 on
Ø0.4 SMD ball pads.
herein. Although considered final, these specifications are subject to change, as further product development and data
Seating
plane
90X 0.45
0.1 A
11.2
0.8 TYP
5.6
90-Ball VFBGA Package
A
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
Note:
9
8
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
3.2
7
All dimensions are in millimeters.
8 ±0.1
6.4
Ball A1 ID
4 ±0.05
3
2
characterization sometimes occur.
1
their respective owners.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
6.5 ±0.05
0.65 ±0.05
0.8 TYP
79
13 ±0.1
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
256Mb: x16, x32 Mobile DDR SDRAM
1.0 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1%Ag, 0.5% Cu)
Package Dimensions
©2005 Micron Technology, Inc. All rights reserved.
Ball A1 ID
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