MT45W8MW16BGX-708 WT TR Micron Technology Inc, MT45W8MW16BGX-708 WT TR Datasheet - Page 63

• Manufacturer Part Number: MT45W8MW16BGX-708 WT TR
• Description: IC PSRAM 128MBIT 70NS 54VFBGA
• Manufacturer: Micron Technology Inc

Specifications of MT45W8MW16BGX-708 WT TR

• Format - Memory: RAM
• Memory Type: PSRAM (Page)
• Memory Size: 128M (8Mx16)
• Speed: 70ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: -30°C ~ 85°C
• Package / Case: 54-VFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1010-2

NOTE:
Data Sheet Designation: Production
maximum limits specified over the complete power
supply and temperature range for production devices.
09005aef80ec6f79 pdf/09005aef80ec6f65 zip
Burst CellularRAM 1.5_128Mb__2.fm - Rev. D 2/05 EN
1. All dimensions in millimeters; MAX/MIN, or typical, as noted.
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.35
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Released: This data sheet contains minimum and
CellularRAM is a trademark of Micron Technology, Inc., inside the U.S. and a trademark of Infineon Technologies outside the U.S.
SEATING PLANE
54X Ø 0.37
6.00
0.10 C
BALL A6
3.00 ±0.05
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
0.70 ±0.05
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
C
1.875 ±0.05
All other trademarks are the property of their respective owners.
8.00 ±0.10
3.75
C L
4.00 ±0.05
ASYNC/PAGE/BURST CellularRAM 1.5 MEMORY
Figure 56: 54-Ball VFBGA
0.75 TYP
0.75 TYP
C L
BALL A1
BALL A1 ID
5.00 ±0.05
10.00 ±0.10
63
Although considered final, these specifications are
subject to change, as further product development
and data characterization sometimes occur.
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL: 96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø 0.30 SOLDER MASK DEFINED
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
©2004 Micron Technology, Inc. All rights reserved.
8 MEG x 16
BALL A1 ID