M1AFS250-FGG256I Actel Corporation, M1AFS250-FGG256I Datasheet - Page 257

• Manufacturer Part Number: M1AFS250-FGG256I
• Description: Actel Fusion Family Of Mixed Signal Fpgas
• Manufacturer: Actel Corporation

Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient, case, or board temperatures. This is an important distinction because dynamic and static power
consumption will cause the chip's junction temperature to be higher than the ambient, case, or board
temperatures.
gradient, and power.
where
Table 3-6 • Package Thermal Resistance
θ
θ
θ
T
T
T
T
P
Product
AFS090-QN108
AFS090-QN180
AFS250-QN180
AFS090-FG256
AFS250-FG256
AFS600-FG256
AFS1500-FG256
AFS600-FG484
AFS1500-FG484
JA
JB
JC
A
J
B
C
= Junction-to-air thermal resistance
= Junction-to-board thermal resistance
= Junction-to-case thermal resistance
= Junction temperature
= Ambient temperature
= Board temperature (measured 1.0 mm away from the
= Case temperature
= Total power dissipated by the device
package edge)
EQ 1
through
X = 7.62; Y = 9.98
X = 7.62; Y = 9.98
X = 5.10; Y = 7.3
X = 5.10; Y = 7.3
X = 3.4; Y = 4.8
X = 3.4; Y = 4.8
X = 4.0; Y = 5.6
X = 3.4; Y = 4.8
X = 4.0; Y = 5.6
Die Size
(mm)
EQ 3
give the relationship between thermal resistance, temperature
Still Air
R e v i s i o n 1
θ
θ
θ
JC
JA
JB
34.5
33.3
32.2
37.7
33.7
28.9
23.3
21.8
21.6
=
=
=
T
----------------- -
T
------------------ -
T
------------------ -
J
J
J
P
P
–
–
–
P
1.0 m/s
θ
T
T
30.0
27.6
26.5
33.9
30.0
25.2
19.6
18.2
16.8
θ
A
B
C
JA
Actel Fusion Family of Mixed Signal FPGAs
2.5 m/s
27.7
25.7
24.7
32.2
28.3
23.5
18.0
16.7
15.2
11.5
θ
8.1
9.2
5.7
9.3
6.8
4.3
7.7
5.6
JC
16.7
21.2
15.0
29.7
24.8
19.9
14.2
16.8
14.9
θ
JB
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
EQ 1
EQ 2
EQ 3
3 -7