M1AFS250-FGG256I Actel Corporation, M1AFS250-FGG256I Datasheet - Page 164
M1AFS250-FGG256I
Manufacturer Part Number
M1AFS250-FGG256I
Description
Actel Fusion Family Of Mixed Signal Fpgas
Manufacturer
Actel Corporation
Datasheet
1.M1AFS250-FGG256.pdf
(330 pages)
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Device Architecture
2- 14 8
Solution 3
The board-level design must ensure that the reflected waveform at the pad does not exceed limits
provided in
This scheme will also work for a 3.3 V PCI/PCIX configuration, but the internal diode should not be used
for clamping, and the voltage must be limited by the bus switch, as shown in
diode clamping would create an excessive pad DC voltage of 3.3 V + 0.7 V = 4 V.
Figure 2-103 • Solution 3
Solution 4
Figure 2-104 • Solution 4
Table 3-4 on page
5.5 V
5.5 V
5.5 V
3-4. This is a long-term reliability requirement.
Bus
Switch
IDTQS32X23
Off-Chip
Rext1
Available for LVCMOS 2.5 V / 5.0 V.
Off-Chip
Requires one board resistor.
Requires a bus switch on the board,
LVTTL/LVCMOS 3.3 V I/Os.
R e visio n 1
Solution 4
Solution 3
On-Chip
On-Chip
Fusion I/O Input
Fusion I/O Input
2.5 V On-Chip
Clamp
Diode
3.3 V
2.5 V
Figure
2-103. Relying on the
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