S71WS256NC0BAWE32 SPANSION [SPANSION], S71WS256NC0BAWE32 Datasheet - Page 82

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S71WS256NC0BAWE32

Manufacturer Part Number
S71WS256NC0BAWE32
Description
Stacked Multi-Chip Product (MCP)
Manufacturer
SPANSION [SPANSION]
Datasheet
A d v a n c e
I n f o r m a t i o n
Erase Command Sequence (last two cycles)
Read Status Data
V
IH
CLK
V
IL
t
AVDP
AVD#
t
AH
t
AS
SA
VA
VA
Addresses
2AAh
555h for
10h for
chip erase
chip erase
In
Data
55h
30h
Complete
Progress
t
DS
t
DH
CE#
t
OE#
CH
t
WP
WE#
t
WHWH2
t
CS
t
WPH
t
WC
t
VCS
V
CC
Figure 14.13 Chip/Sector Erase Operation Timings
80
S71WS-Nx0 Based MCPs
S71WS-N_01_A4 September 15, 2005

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