S71WS256NC0BAWE32 SPANSION [SPANSION], S71WS256NC0BAWE32 Datasheet - Page 18

• Manufacturer Part Number: S71WS256NC0BAWE32
• Description: Stacked Multi-Chip Product (MCP)
• Manufacturer: SPANSION [SPANSION]

16
5.2.2
Look-Ahead Connection Diagram
Notes:
1.
2.
F-DQS0
In a 3.0V system, the GL device used as Data has to have WP tied to V
F1 and F2 denote XIP/Flash, F3 and F4 denote Data/Companion Flash
RFU
RFU
RFU
N1
B1
N1
A1
P1
R1-CE1#
F1-CE#
R-VCC
AVD#
WP#
RFU
RFU
A27
RFU
RFU
C2
D2
G2
G2
H2
H2
M2
B2
E2
F2
F2
K2
L2
N2
A2
A3
A2
A1
A0
J2
P2
OE#
DQ0
DQ8
VSS
VSS
A26
M3
D3
G3
G3
H3
H3
K3
K3
C3
A7
E3
A6
F3
F3
A5
A4
L3
L3
J3
R-UB#
R-LB#
DQ10
A d v a n c e
DQ1
DQ9
DQ2
A18
VSS
CLK
A17
C4
M4
D4
D4
G4
G4
H4
H4
K4
K4
F4
F4
J4
L4
L4
S71WS-Nx0 Based MCPs
RDY/WAIT#
R2-VCC
F2-CE#
F-RST#
R2-CE1
F-VCC
F-VCC
DQ11
DQ3
ACC
M5
C5
D5
C7
G5
H5
K5
F5
J5
L5
L5
R1-VCC
R1-CE2
R2-CE2
F4-CE#
F-VCC
WE#
DQ4
A20
A23
A25
D6
G6
G6
H6
M6
E6
F6
F6
E6
L6
L6
C6
C6
C6
C6
J6
I n f o r m a t i o n
R-VCCQ
F-CLK#
DQ13
DQ12
DQ6
DQ5
A19
A10
M7
D7
G7
G7
H7
K7
K7
C7
A8
E7
F7
F7
A9
L7
L7
J7
F-VCCQ
R-OE#
DQ15
DQ14
DQ7
A11
A12
A13
A14
M8
D8
G8
G8
H8
A24
K8
K8
C8
E8
F8
F8
J8
L8
L8
CC
R-CRE or
F2-OE#
R-CLK#
F3-CE#
R-MRS
WP#
RFU
RFU
A15
A21
A22
A16
VSS
RFU
RFU
M9
B9
C9
D9
G9
G9
H9
K9
K9
A9
E9
F9
F9
J9
L9
N9
P9
Ball
D2
D5
F5
WP#/ACC
3.0 V V
S71WS-N_01_A4 September 15, 2005
F-DQS1
RY/BY
N10
A10
B10
P10
RFU
RFU
RFU
NC
CC
F-RDY/R-WAIT#
Code Flash Only
(Reserved for
MirrorBit Data
xRAM Shared
1.8 V V
Flash/xRAM
pSRAM Only
Future Use)
Flash/Data
F-WP#
Legend:
ACC
Shared
Shared
RFU
Only
X
X
X
X X
X
X X
X
X
X X
X
X X
CC