mcimx27- Freescale Semiconductor, Inc, mcimx27- Datasheet - Page 119

• Manufacturer Part Number: mcimx27-
• Description: Multimedia Applications Processor
• Manufacturer: Freescale Semiconductor, Inc

4.4
Table 60
these pins depend solely upon the user application, however there are a few factory test signals that are
not used in a normal application. Following is a list of these signals and how they are to be terminated for
proper operation of the i.MX27/MX27L processor:
Table 60
Freescale Semiconductor
•
•
•
•
•
CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.
OSC26M_TEST: To ensure proper operation, leave this signal as no connect.
EXT_60M: To ensure proper operation, connect this signal to ground.
EXT_266M: To ensure proper operation, connect this signal to ground.
Most of the signals shown in
of the signals at a particular pad are shown in the form of a compound signal name. Please refer to
Table 3
identifies the pin assignments for the ball grid array (BGA) for full package. The connections of
shows the device.
Pin Assignments (19mm x 19mm)
for complete information on the signal multiplexing schemes of these signals.
Table 60. i.MX27 23 x 23 BGA (19 x 19) - Signal ID by Ball Grid Location
Location
AA10
Preliminary—Subject to Change Without Notice
AA1
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A3
A4
A5
A6
A7
A8
A9
i.MX27 and i.MX27L Data Sheet, Rev. 1.2
Table 60
SSI3_FS_SLCDC2_D0_PC28
SSI3_CLK_SLCDC2_CLK_PC31
KP_ROW3
UART2_CTS_KP_COL7_PE3
PWMO_PE5
KP_COL4
UART3_TXD_PE8
UART1_RXD_PE13
RTCK_OWIRE_PE16
SD1_D1_PE19
SD1_CMD_CSPI3_MOSI_PE22
CSPI1_MISO_PD30
SD2_D3_MSHC_DATA3_PB7
CSI_D1_UART6_RXD_PB11
CSI_MCLK_PB15
CSI_D5_PB17
TOUT_PC14
SSI4_CLK_PC19
SSI1_CLK_PC23
SD25
A15
are multiplexed with other signals. For ease of reference, all
Contact Name
Package Information and Pinout
119