mcimx27- Freescale Semiconductor, Inc, mcimx27- Datasheet - Page 118

• Manufacturer Part Number: mcimx27-
• Description: Multimedia Applications Processor
• Manufacturer: Freescale Semiconductor, Inc

Package Information and Pinout
1. GND and QVSS contacts are tied together inside the BGA package
2. Freescale recommends tying GND and QVSS contacts to a single plane.
4.3
See
118
Figure 69
Full Package Outline Drawing (19mm
Table 59. i.MX27 24 x 24 BGA (17 x 17) - Signal ID by Ball Grid Location (continued)
Figure 69. i.MX27/MX27L 19 x 19 mm Full Package MAPBGA: Mechanical Drawing
for package drawings and dimensions of the production package.
Preliminary—Subject to Change Without Notice
i.MX27 and i.MX27L Data Sheet, Rev. 1.2
Pin Name
XTAL26M
XTAL32K
×
19mm)
Ball Grid
Location
AA24
N24
Freescale Semiconductor