mt29f1gxxabb Micron Semiconductor Products, mt29f1gxxabb Datasheet - Page 69

• Manufacturer Part Number: mt29f1gxxabb
• Description: 1gb X8, X16 Nand Flash Memory
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 65:
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1gb_nand_m48a__2.fm - Rev. E 1/08 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
63X Ø0.45
Dimensions
apply to solder
balls post reflow.
Pre-reflow ball
is Ø0.42 on a Ø0.4
SMD ball pad.
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
for production devices. Although considered final, these specifications are subject to change, as further product develop-
Seating
plane
0.10 A
8.80
Ball A10
4.40
63-Ball VFBGA Package
A
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
Note:
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
3.60
10.50 ±0.10
All dimensions are in millimeters.
0.80 TYP
7.20
C L
ment and data characterization sometimes occur.
5.25 ±0.05
their respective owners.
0.80 TYP
C L
6.50 ±0.05
Ball A1
69
Ball A1 ID
0.65 ±0.05
13.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
1Gb: x8, x16 NAND Flash Memory
Solder ball material:
Substrate material: Plastic laminate
Mold compound: Epoxy novolac
96.5% Sn, 3%Ag, 0.5% Cu
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
Ball A1 ID