pga370 ETC-unknow, pga370 Datasheet - Page 64

• Manufacturer Part Number: pga370
• Description: Mpu Pentium Iii 64-bit 0.18um 700mhz 370-pin Fcpga
• Manufacturer: ETC-unknow

Pentium
64
Table 37. Package Dimensions for Intel
Table 38. Processor Case Loading Parameters for FC-PGA2
Figure 25. FC-PGA2 Flatness Specification
®
III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
NOTE: Capacitors will be placed on the pin-side of the FC-PGA package in the area defined by G1, G2, and
For
NOTES:
1. Transient loading refers to a one time short duration loading, such as during heatsink installation.
2. Dynamic loading refers to a shock load.
3. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
4. Please see socket manufacturer’s force loading specification also to ensure compliance. Maximum static
IHS Surface
IHS Edge
IHS Corner
1. It is not recommended to use any portion of the processor substrate as a mechanical reference
2. Parameters assume uniformly applied loads
Symbol
Pin TP
processor interface.
loading listed here does not account for the maximum reaction forces on the socket tabs or pins. Designs
must ensure that the socket can withstand this force.
Table
or load bearing surface for thermal solutions.
G3. This area is a keepout zone for motherboard designers.
Parameter
38, the following apply:
Note: Flatness specifications in millimeters
Minimum
0.508 Diametric True Position (Pin-to-Pin)
Transient
(max)
Millimeters
Maximum
200
125
75
1, 4
®
Pentium
Dynamic
(max)
200
N/A
N/A
Notes
2, 4
®
III Processor FC-PGA2 Package
(max)
Static
100
N/A
N/A
3, 4
Minimum
0.020 Diametric True Position (Pin-to-Pin)
Unit
lbf
lbf
lbf
Maximum
Inches
Datasheet
Notes