pga370 ETC-unknow, pga370 Datasheet - Page 58

• Manufacturer Part Number: pga370
• Description: Mpu Pentium Iii 64-bit 0.18um 700mhz 370-pin Fcpga
• Manufacturer: ETC-unknow

Pentium
4.3
58
Figure 21. Processor Functional Die Layout for FC-PGA
Table 32. Processor Functional Die Layout for FC-PGA
Note: The reading of the thermal sensor connected to the thermal diode will not necessarily reflect the
®
III Processor for the PGA370 Socket at 500 MHz to 1.10 GHz
Thermal Diode
The Pentium III processor for the PGA370 socket incorporates an on-die diode that may be used to
monitor the die temperature (junction temperature). A thermal sensor located on the motherboard,
or a stand-alone measurement kit, may monitor the die temperature of the processor for thermal
management or instrumentation purposes.
interface specifications. For more information please refer to the document, Intel
Processor in the FC-PGA2 Package Thermal Design Guide.
temperature of the hottest location on the die. This is due to inaccuracies in the thermal sensor, on-
die temperature gradients between the location of the thermal diode and the hottest location on the
die at a given point in time, and time based variations in the die temperature measurement. Time
based variations can occur when the sampling rate of the thermal diode (by the thermal sensor) is
slower than the rate at which the T
A: Die Area
CPUID
068AH
0683H
0686H
B: Core Area (~63% of die area)
A: Die Area (cm
1.046
0.900
0.947
junction
2
)
temperature can change.
Table 33
B: Core Area (cm
and
0.726
0.642
0.642
Table 34
2
provide the diode parameter and
Pin 1
)
C: Cache Area
C: Cache Area (cm
Product Label
0.320
0.258
0.305
®
Pentium
Datasheet
2
)
®
III