mt45w8mw16bgx Micron Semiconductor Products, mt45w8mw16bgx Datasheet - Page 68

• Manufacturer Part Number: mt45w8mw16bgx
• Description: 128mb 8 Meg X 16 Async/page/burst Cellularram 1.5 Async/ Page/burst Cellularram 1.5 Memory
• Manufacturer: Micron Semiconductor Products

Package Information
Figure 56:
PDF: 09005aef80ec6f79/Source: 09005aef80ec6f65
128mb_burst_cr1_5_p26z__2.fm - Rev. H 9/07 EN
their respective owners. This data sheet contains minimum and maximum limits specified over the power supply and tem-
Technology, Inc., inside the U.S. and a trademark of Qimonda AG outside the U.S. All other trademarks are the property of
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron
perature range set forth herein. Although considered final, these specifications are subject to change, as further product
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW.
PRE-REFLOW BALL
DIAMETER IS 0.35
ON A 0.30 SMD
BALL PAD.
SEATING
6.00
PLANE
0.10 A
54X Ø 0.37
BALL A6
3.00
54-Ball VFBGA
Notes:
0.70 ±0.05
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
A
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. The MT45W8MW16BGX uses “green” packaging.
1.875
0.25mm per side.
8.00 ±0.10
development and data characterization sometimes occur.
3.75
C L
128Mb: 8 Meg x 16 Async/Page/Burst CellularRAM 1.5 Async/
4.00 ±0.05
0.75 TYP
0.75 TYP
C L
BALL A1
BALL A1 ID
5.00 ±0.05
68
10.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Page/Burst CellularRAM 1.5 Memory
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
96.5% Sn, 3% Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
©2004 Micron Technology, Inc. All rights reserved.
BALL A1 ID