mt47h64m8b6-5e-it Micron Semiconductor Products, mt47h64m8b6-5e-it Datasheet - Page 18

no-image

mt47h64m8b6-5e-it

Manufacturer Part Number
mt47h64m8b6-5e-it
Description
512mb X4, X8, X16 Ddr2 Sdram
Manufacturer
Micron Semiconductor Products
Datasheet
Figure 11:
PDF: 09005aef82f1e6e2/Source: 09005aef821aed36
512Mb_DDR2_x4x8x16_D2.fm - 512Mb DDR2: Rev. L; Core DDR2: Rev. C 4/08 EN
SEATING
PLANE
SOLDER BALL
DIAMETER REFERS
TO POST-REFLOW
CONDITION.
11.2
0.12 C
84X Ø0.45
C
84-Ball FBGA (12mm x 12.5mm) – x16
Notes:
1. All dimensions are in millimeters.
12.0 ±0.15
6.4
C L
TYP
0.8
C L
0.80 TYP
0.8 ±0.1
BALL A1 ID
18
12.5 ±0.15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.2 MAX
512Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
BALL A1 ID Location
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved.

Related parts for mt47h64m8b6-5e-it