mt46h32m32lfcm-6 Micron Semiconductor Products, mt46h32m32lfcm-6 Datasheet - Page 12

• Manufacturer Part Number: mt46h32m32lfcm-6
• Description: 1gb X16, X32 Mobile Ddr Sdram
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 6:
PDF: 09005aef82ce3074/Source: 09005aef82cd0158
1gb_ddr_mobile_sdram_t48m_density__2.fm - Rev. G 07/08 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls
are Ø0.42 on Ø0.4
SMD ball pads.
Seating
plane
60X Ø0.45
0.1 A
7.2
0.8 TYP
0.8 TYP
3.6
60-Ball VFBGA Package
A
Notes:
9
8
1. All dimensions are in millimeters.
7
10 ±0.1
6.4
3.2
3
5 ±0.05
2
1
A
D
G
H
B
C
E
K
F
J
Ball A1 ID
12
5.75 ±0.05
0.65 ±0.05
11.5 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
1Gb: x16, x32 Mobile DDR SDRAM
Solder ball material:
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Substrate material: plastic laminate
Mold compound: epoxy novolac
Package Dimensions
Ball A1 ID
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